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Low Energy, Focused Beam Ion Implantation for Semiconducting Materials and Devices

This special issue belongs to the section “D1: Semiconductor Devices“.

Special Issue Information

Dear Colleagues,

Ion implantation is a key capability for the semiconductor industry. As devices shrink, novel materials enter the manufacturing line, and quantum technologies transition to being more mainstream, traditional implantation methods fall short in terms of energy, ion species, and positional precision. This is especially relevant for functionalization of 2D materials, as implanting into a single atomic layer with high spatial resolution combines multiple challenges in ion sources, optics, and material processing.

Precisely placing and incorporating a variety of ions and vacancies into 2D materials is a technological gap that needs to be addressed for IEEE predicted roadmap for mass utilization of 2D materials in the consumer electronics by the 2030s, technological space around 2D material-based sensors, and emerging interests in using 2D materials as single photon emitters for quantum applications. This Special Issue seeks to highlight recent advanced in ion implantation, ion optics, and theoretical simulations via research papers, and review articles that describe the most salient physics, methodologies, and outstanding issues in the ion beam community, for directly implanting ions into 2D materials.

We look forward to receiving your submissions!

Dr. Alex Belianinov
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • ion implantation
  • focused ion beams
  • 2D materials
  • semiconductors devices
  • nanofabrication
  • in situ

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Micromachines - ISSN 2072-666X