Recent Advances in 3D Integration Technologies

Dear Colleagues,

In recent decades, the semiconductor industry has consistently followed Moore’s Law, which boosts computing power to the next level approximately every two years. However, with the deceleration of the fabrication node evolvement, 3D integration, which is interpreted as ‘More than Moore’, has started to demonstrate the potential to extend the lifespan of Moore’s Law. 3D integration targets the integration of the transistors or chips not only horizontally, but most importantly, vertically, thus forming a new type of semiconductor chip that accommodates much higher transistor density, which enables huge compute power leaps as the stack goes beyond a single layer. Accordingly, this Special Issue seeks recent advances in 3D integration technologies, including research papers, communications, and review articles that focus on specific technology including, but not limited to, 3D interconnections, bonding techniques, thermal management, reliability, co-packaged optics, new materials and equipment for integration, and applications with 3D integration.

Dr. Qidong Wang
Prof. Dr. Wei Wang
Guest Editors

Manuscript Submission Information

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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• 3D integration
• bonding
• thermal management
• reliability
• OPC
• integration material
• 3D integration application