Special Issue "14th International Conference on Barkhausen Noise and Micromagnetic Testing: Micromagnetic Sensors—From Design to Applications"

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E:Engineering and Technology".

Deadline for manuscript submissions: 30 November 2022 | Viewed by 278

Special Issue Editors

Dr. Robert Tomkowski
E-Mail Website
Guest Editor
Production Engineering Department, KTH Royal Institute of Technology, 100 44 Stockholm, Sweden
Interests: precision engineering; micromachines; surface engineering; industrial metrology; Barkhausen noise testing
Dr. Suvi Santa-aho
E-Mail Website
Guest Editor
Faculty of Engineering and Natural Sciences, Tampere University, 33100 Tampere, Finland
Interests: non-destructive testing; Barkhausen noise; residual stresses; material characterization; surface integrity; grinding

Special Issue Information

Dear Colleagues,

The 14th International Conference on “Barkhausen Noise and Micromagnetic Testing: Micromagnetic sensors – From design to applications” (ICBM14) will take place between 27 and 30 September 2022 in Stockholm (Sweden), the city of Alfred Nobel, organized by the KTH Royal Institute of Technology. The ICBM is a biannual series of conferences that started in 1998 and covers areas of Barkhausen Noise and micromagnetic testing, including the development of new sensors, modeling and simulation, modern trends, material characterization, and applications. This conference's focus is on micromagnetic sensors and their development from design to applications.

For the ICBM14 conference, it is our ambition to bring together academics and industries from all over the world for an excellent scientific event. In this Special Issue, selected full-length papers presented during ICBM14 will be published on significant and original works related to all aspects of:

  1. Design, development, and optimization of micromagnetic sensors;
  2. Numeric and mathematical modeling, and simulation of micromagnetic sensors;
  3. Material and surface integrity characterization;
  4. Residual stress measurements using Barkhausen Noise Technique;
  5. Modern measurement data analysis;
  6. Industrial applications—user cases.

All papers will be peer-reviewed for the validation of research results, developments, and applications.

Dr. Robert Tomkowski
Dr. Suvi Santa-aho
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • micromagnetic sensors
  • non-destructive testing
  • Barkhausen Noise
  • surface integrity
  • residual stress
  • modeling and simulation
  • data analysis

Published Papers

This special issue is now open for submission.
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