3D Integration: Trends, Challenges and Opportunities
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".
Deadline for manuscript submissions: closed (30 April 2025) | Viewed by 1549
Special Issue Editors
Interests: micro/nano fabrication; MEMS (micro-electromechanical systems) sensors; TSV; three-dimensional integration
Special Issues, Collections and Topics in MDPI journals
Interests: 3D integration; hybrid bonding; antenna-in-package; power module
Special Issues, Collections and Topics in MDPI journals
Interests: 3D (three-dimensional) integration; TSV (through-silicon via) three-dimensional integration manufacturing techniques; wafer-bonding technology; embedded microfluidic cooling technology; PMUT (piezoelectric micromachined ultrasonic transduce) and its applications
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
As chip fabrication processes continue to diminish in size and approach the physical limits, relying on reducing transistor gate dimensions to achieve optimal chip performance and complex chip structures presents substantial challenges. Shifting towards new chip design architectures, 3D chip stacking has become a popular technical path. The rapid development of 3D integration technology, incorporating new materials and fabrication processes, is being extensively applied in various areas of chip integration and packaging manufacturing. This aims to enhance chip functionalities and achieve miniaturization in system integration while reducing costs.
In view of the latest advancements in this field, we announce this Special Issue, titled “3D Integration: Trends, Challenges and Opportunities”. Therefore, we invite the submission of papers in the fields of integrated circuit manufacturing, electronic engineering, communication technology, advanced packaging technology, and 3D integration application technology. We welcome the submission of papers related to all aspects of 3D integration technology, including, but not limited to, the following:
- TSV three-dimensional integration manufacturing technology;
- Manufacturability and reliability modeling and simulation technology;
- Efficient thermal management technology;
- Embedded microchannel technology;
- Integrated circuit design;
- New methods in electronic packaging and interconnect technology;
- New materials and processes in microelectronics manufacturing;
- System-level packaging technology;
- Application of nanotechnology and quantum computing in 3D integration;
- Novel sensor manufacturing and packaging technology;
- Micro electromechanical
Through these in-depth analyses and discussions, we aim to provide new insights and directions for the innovation and development of 3D integration technology.
Prof. Dr. Yufeng Jin
Dr. Qidong Wang
Dr. Shenglin Ma
Guest Editors
Manuscript Submission Information
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Keywords
- 3D integration
- advanced packaging
- TSV
- microchannels
- DFM
- DFR
- integrated circuit design
- reliability
- manufacturability
- sensors
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