Advanced Packaging Technology for MEMS Devices
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D1: Semiconductor Devices".
Deadline for manuscript submissions: 30 June 2025 | Viewed by 855
Special Issue Editor
Interests: laser material processing; MEMS LIDAR systems; glass packages for wafer-level packaging
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Advanced packaging technology for MEMS devices is crucial for their successful commercialization and performance. Advanced packaging is important for MEMS devices because it ensures the reliability and longevity of these devices. Moreover, the growing advanced packaging technology also enables increasing system integration and sensor fusion. Under advanced packaging, several technology clusters are developing simultaneously. Wafer-level-packaging (WLP) integrates the MEMS device and packaging at the wafer level, allowing the highest integration grade and cost efficiency. In addition, more and more new chip-level packaging technologies and materials have been investigated and drawing attention for advanced packaging technologies, which allows higher system flexibility. The various technology clusters are gaining increasing importance in modern electronics and sensor applications.
Prof. Dr. Shanshan Gu-Stoppel
Guest Editor
Manuscript Submission Information
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Keywords
- advanced packaging
- wafer-level packaging
- wafer bonding
- heterogene packaging
- chiplet
- 3D integration
- sensor fusion
- smart sensor system
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