High-Uniformity Core-Shell Nanofibers for Semiconductor Packaging: Process Optimization and Performance Study of Airflow-Assisted Coaxial Electrospinning
Abstract
1. Introduction
2. Design and Simulation Analysis of Airflow Nozzles
2.1. Establishment of Flow Nozzle Simulation Geometric Model
2.2. Simulation Results Analysis of the Influence of Different Inner Diameters of the Airflow Nozzle on the Airflow Field
3. Experiment
3.1. Experimental Materials
3.2. Solution Preparation
3.3. Fabrication of Nanofiber Membrane
3.4. Characterize
3.5. Results and Discussion
3.5.1. The Effect of Working Voltage on Fiber Diameter
3.5.2. The Effect of Airflow Pressure on Fiber Diameter
3.5.3. The Effect of the Inner Diameter of the Airflow Nozzle on Fiber Diameter
4. Response Surface Analysis and Experimental Verification
4.1. Experimental Design of Response Surfaces
4.2. Analysis of Response Surface Results
4.3. Optimization and Validation
5. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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| Coaxial Nozzle Outer Diameter | Working Pressure | Airflow Environment Zone |
|---|---|---|
| 2.08 mm | 15 kPa | Pi × (100 mm)2 × 150 mm |
| Voltage (kV) | Air Pressure (kPa) | Inner Diameter of Airflow Nozzle (mm) | ||
|---|---|---|---|---|
| Single-factor experiment of voltage | 16/17/18/19/20 | 15 | 3.12 | |
| Single-corfactor experiment of air pressure | 17 | 5/10/15/20/25 | 3.12 | |
| Single-factor experiment on the inner diameter of the airflow nozzle | 17 | 15 | 2.7/2.9/3.12/3.32/3.52 | |
| Factor | Code | Level | ||
|---|---|---|---|---|
| −1 | 0 | 1 | ||
| Air pressure (kPa) | A | 10 | 15 | 20 |
| Voltage (kV) | B | 16 | 17 | 18 |
| Inner diameter of the airflow nozzle (mm) | C | 3.12 | 3.32 | 3.52 |
| Number | Air Pressure (kPa) | Voltage (kV) | Inner Diameter of the Airflow Nozzle (mm) | CV of Diameter |
|---|---|---|---|---|
| 1 | 10 | 16 | 3.32 | 0.0917 |
| 2 | 20 | 16 | 3.32 | 0.0903 |
| 3 | 10 | 18 | 3.32 | 0.0948 |
| 4 | 20 | 18 | 3.32 | 0.0958 |
| 5 | 10 | 17 | 3.12 | 0.1116 |
| 6 | 20 | 17 | 3.12 | 0.0904 |
| 7 | 10 | 17 | 3.52 | 0.0964 |
| 8 | 20 | 17 | 3.52 | 0.0987 |
| 9 | 15 | 16 | 3.12 | 0.0986 |
| 10 | 15 | 18 | 3.12 | 0.0974 |
| 11 | 15 | 16 | 3.52 | 0.0931 |
| 12 | 15 | 18 | 3.52 | 0.0963 |
| 13 | 15 | 17 | 3.32 | 0.0875 |
| 14 | 15 | 17 | 3.32 | 0.0839 |
| 15 | 15 | 17 | 3.32 | 0.0849 |
| 16 | 15 | 17 | 3.32 | 0.0888 |
| 17 | 15 | 17 | 3.32 | 0.0845 |
| Source | Sum of Squares | Mean Square | F-Value | p-Value | |
|---|---|---|---|---|---|
| Model | 0.0007 | 0.0001 | 7.99 | 0.0060 | significant |
| A | 0.0000 | 0.0000 | 4.93 | 0.0619 | |
| B | 0.0000 | 0.0000 | 1.49 | 0.2623 | |
| C | 0.0000 | 0.0000 | 2.41 | 0.1645 | |
| AB | 1.440 × 10−6 | 1.440 × 10−6 | 0.1523 | 0.7079 | |
| AC | 0.0001 | 0.0001 | 14.61 | 0.0065 | significant |
| BC | 4.840 × 10−6 | 4.840 × 10−6 | 0.5120 | 0.4974 | |
| A2 | 0.0001 | 0.0001 | 11.48 | 0.0116 | significant |
| B2 | 0.0000 | 0.0000 | 2.06 | 0.1940 | |
| C2 | 0.0003 | 0.0003 | 30.52 | 0.0009 | significant |
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Chen, X.; Huang, S.; Zhang, R.; Zhang, X.; Long, J.; Lin, G. High-Uniformity Core-Shell Nanofibers for Semiconductor Packaging: Process Optimization and Performance Study of Airflow-Assisted Coaxial Electrospinning. Micromachines 2026, 17, 463. https://doi.org/10.3390/mi17040463
Chen X, Huang S, Zhang R, Zhang X, Long J, Lin G. High-Uniformity Core-Shell Nanofibers for Semiconductor Packaging: Process Optimization and Performance Study of Airflow-Assisted Coaxial Electrospinning. Micromachines. 2026; 17(4):463. https://doi.org/10.3390/mi17040463
Chicago/Turabian StyleChen, Xun, Shize Huang, Rongguang Zhang, Xuanzhi Zhang, Jiecai Long, and Guohuai Lin. 2026. "High-Uniformity Core-Shell Nanofibers for Semiconductor Packaging: Process Optimization and Performance Study of Airflow-Assisted Coaxial Electrospinning" Micromachines 17, no. 4: 463. https://doi.org/10.3390/mi17040463
APA StyleChen, X., Huang, S., Zhang, R., Zhang, X., Long, J., & Lin, G. (2026). High-Uniformity Core-Shell Nanofibers for Semiconductor Packaging: Process Optimization and Performance Study of Airflow-Assisted Coaxial Electrospinning. Micromachines, 17(4), 463. https://doi.org/10.3390/mi17040463

