Microstructural, Mechanical and Magnetic Properties of Metallic Microwires

A special issue of Metals (ISSN 2075-4701).

Deadline for manuscript submissions: 31 December 2024 | Viewed by 347

Special Issue Editors

E-Mail Website
Guest Editor
School of Materials Science and Engineering, Inner Mongolia University of Technology, Hohhot, China
Interests: Metallic microwires; microstructural characterization; mechanical property; magnetic property; physical and chemical effects; functional device; sensor applications
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
School of Materials Science and Engineering, Harbin Institute of Technology, Harbin, China
Interests: metallic microwires; mechanical property; magnetic refrigeration; functional devices and applications

Special Issue Information

Dear Colleagues,

The investigation of metallic microwires is considered by international experts in the field of microwires as one of the novel research directions with potential application prospects. Metallic microwires exhibit special microstructural, mechanical and magnetic properties due to the unique preparation processes, and they exhibit different properties from those of bulk metallic glasses (BMGs). Therefore, particular mechanical and magnetic properties of metallic microwires provide the possibility of performance modulation and functional integration applications, especially according to microstructural evolution. Nowadays, researchers pay lots of attention to metallic microwires, particularly in the fields of structural and functional devices, electromagnetic shielding, microwave absorption, magnetic detection and refrigeration, etc. Meanwhile, some basic scientific issues of metallic microwires still need to be further studied, revealed and clarified.

In this Special Issue, we invite you to contribute articles that focus on the latest research progress related to preparation processes, including rapid solidification (RS) technology, microstructural characterization and mechanical and magnetic properties, and the interesting physical and chemical effects of metallic microwires, as well as articles that demonstrate innovative multi-functional devices and potential applications based on advanced metallic microwires.

Prof. Dr. Jingshun Liu
Dr. Hongxian Shen
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers

This special issue is now open for submission.
Back to TopTop