Application of Thermal Plasma in Materials Processing

Dear Colleagues,

Due to its ultra-high energy density, ultra-high temperature, ultra-fast speed, and diverse chemical activities, thermal plasma can be applied to rapidly and selectively change the states and properties of materials across multiple scales. Based on the different interaction mechanisms between these extreme manufacturing characteristics and the materials to be processed, unique properties and/or surface structures of different materials and components can be attained, outperforming those achieved using conventional manufacturing techniques. Thus, thermal plasma has been an enabling tool for materials processing and thus attracted wide attention for research in both academia and the industry, resulting in the development of diverse materials processing techniques, e.g., plasma spraying, plasma atomization, plasma spheroidization, plasma hardening, plasma etching, etc. However, thermal plasma is essentially interdisciplinary in nature, and sufficient communication between researchers from different disciplines is lacking; thus, this Special Issue has been proposed as a means for bridging this gap. The key topics of this Special Issue include but are not limited to revelation of the underlying scientific mechanisms operating in the materials during processing by thermal plasma, e.g., the interactions between plasma and materials at an atomic or molecular scale as well as their control mechanisms, the fundamental principles and mechanisms of plasma-based materials processing, removal and synthesis of different materials, etc. Meanwhile, breakthroughs in new plasma-based technologies will also be covered, e.g., methods for thermal plasma generation and the development of special equipment that can be used in different scenarios for multiple fields and industries, which can solve a series of problems such as equipment stability, processing determinacy, and cost effectiveness, etc.

In order to share and communicate relevant research findings, I sincerely invite you to submit a manuscript to the Special Issue “Application of Thermal Plasma in Materials Processing”. Full papers, communications, and reviews are all welcome.

Prof. Dr. Deping Yu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

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