Special Issue "Smart Materials Technologies"

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Smart Materials".

Deadline for manuscript submissions: 31 December 2021.

Special Issue Editors

Prof. Dr. Ricardo Branco
Guest Editor
Department of Mechanical Engineering, University of Coimbra, 3004-531 Coimbra, Portugal
Interests: Additive manufacturing; mechanical behavior of materials; fatigue and fracture; multiaxial fatigue life prediction; low cycle fatigue; fatigue crack initiation; numerical modeling of fatigue crack growth
Special Issues and Collections in MDPI journals
Prof. Dr. Filippo Berto
Guest Editor
Department of Mechanical and Industrial Engineering, Norwegian University of Science and Technology, 7491 Trondheim, Norway
Interests: additive manufacturing; structural integrity; materials design; solids mechanics; fatigue
Special Issues and Collections in MDPI journals

Special Issue Information

Dear Colleagues,

The 6th International Conference on Smart Materials Technologies (ICSMT 2021) will take place in Kazan, Russian Federation on May 28–30, 2021. It has been organized by the Science and Engineering Institute with the support of Magnitogorsk State Technical University and Novosibirsk State Technical University. The objective of this Special Issue is to publish outstanding papers presented at the conference which address cutting-edge advances, new ideas, and research results in the field of smart materials technologies. Examples of innovative and successful industrial applications, as well as nonconventional approaches, are also encouraged. The topics covered by this Special Issue include (but are not limited to): (a) materials science and engineering; (b) materials manufacturing and processing; and (c) materials properties, measuring methods, and applications. Research based on analytical methods, experimental testing or numerical modeling is acceptable. Literature review articles are also welcome. This Special Issue is also open to authors who will not be attending the conference.

Prof. Dr. Ricardo Branco
Prof. Dr. Filippo Berto
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • Metallic alloys
  • Superplastic materials
  • Ceramics and glasses
  • Composites
  • Amorphous materials
  • Nanomaterials
  • Biomaterials
  • Multifunctional materials
  • Smart materials
  • Engineering polymers
  • Functional materials
  • Magnetic materials
  • Superconducting materials
  • Casting
  • Powder metallurgy
  • Welding
  • Sintering
  • Thermochemical treatment
  • Coatings
  • Surface treatment
  • Machining
  • Plastic forming

Published Papers

This special issue is now open for submission.
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