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Silicon Carbide and Other Wide Bandgap Materials: Fundamentals, Device Applications and Future Prospects

Special Issue Information

Dear Colleagues,

As a promising wide bandgap semiconductor, Silicon Carbide (SiC) has attracted increasing attention due to the recent achievements in wafer growth technology and its outstanding materials properties such as higher values for breakdown electric field, saturation velocity and superior thermal conductivity.

SiC, being one of the most widely used wide bandgap materials, plays a critical role in power industries by setting new standards in power savings as switches or rectifiers in the system for electric vehicles, wind turbines, solar cells, data centers, as well as high temperature and radiation tolerant electronic applications.

This Special Issue of Materials, entitled “Silicon Carbide and Other Wide Bandgap Materials: Fundamentals, Device Applications and Future Prospects” is focused on recent progress in all topics related to SiC materials and devices. We invite submission of research articles (full papers, communications and reviews) focusing on recent developments in the synthesis, processing, design and characterization of SiC materials and devices, as well as its applications to systems.

We will accept articles in distinct areas of applications and a wide range of topics on both experimental and theoretical works and the topics to be covered in this special issue covers will cover include, but are not limited to:

  • Bulk and Epitaxial Growth of SiC
  • Heterostructures or related materials (graphene, GaN, Ga2O3, ZnO, etc.) grown on SiC
  • Defect Analysis and Engineering
  • Device Design and Fabrication Processes in SiC
  • Packaging, Applications and Reliability for Power Electronics
  • Novel devices

Prof. Dr. Sang-Mo Koo
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • silicon carbide
  • wide bandgap semiconductors
  • power devices
  • heterostructures on silicon carbide
  • device design in silicon carbide and related materials
  • defect analysis in silicon carbide and related materials
  • reliability of silicon cardbie based devices and system

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Materials - ISSN 1996-1944