Next-Generation Metal Additive Manufacturing: Intelligent Microstructure Design, Mechanical Reliability, and Advanced Material Systems for Industrial Applications

Dear Colleagues,

It is my pleasure to invite you to contribute to our upcoming Special Issue on “Next-Generation Metal Additive Manufacturing: Intelligent Microstructure Design, Mechanical Reliability, and Advanced Material Systems for Industrial Applications.”

Metal Additive Manufacturing (AM) is rapidly transforming aerospace, biomedical, energy, and automotive industries. However, challenges remain in realizing its full potential all the way from controlling microstructure and defect populations, to making sure that these parts have long-term reliability and enabling new material systems. This Special Issue aims to highlight such cutting-edge advances that address these barriers and open new pathways for industrial adoption.

We would like to invite original research articles, reviews, and perspectives in (but not limited to) the following areas:

1. Intelligent Microstructure Design: process–structure–property modeling, data-driven/AI-assisted alloy and process development, and grain/texture engineering strategies.
2. Mechanical Reliability: Fatigue, fracture, creep, and environmental performance of additively manufactured alloys along with defect-tolerant design approaches and residual stress mitigation and qualification methodologies.
3. Advanced Material Systems: Novel high temperature or high entropy alloys tailored for AM, high-temperature and extreme-environment materials, multi-material/graded structures, and sustainable feedstock solutions.
4. Cross-Cutting Enablers: Real-time sensing and feedback control, digital twins, qualification/standardization strategies, in-situ monitoring and process control and design-for-AM frameworks.

By combining insights across these themes, we believe this special issue, will provide a solid foundation to advance next generation AM systems that are intelligent, reliable, and relevant to industry. We hope this issue will bring together a diverse community of researchers and practitioners, to start meaningful conversations across academia, industries and national labs.

We hope you will consider submitting your latest work to this Special Issue. Thank you for your consideration.

Sincerely,

Dr. Kapil Gangwar
Prof. Dr. Ramulu Mamidala
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.