Special Issue "Advanced Strain and Deformation Sensing Materials and Applications"

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Smart Materials".

Deadline for manuscript submissions: 31 May 2021.

Special Issue Editors

Dr. Pedro Costa
E-Mail Website
Guest Editor
Institute for Polymers and Composites IPC/I3N, University of Minho, 4800-058 Guimarães, Portugal and Centro/Departamento de Física, Universidade do Minho, Campus de Gualtar, 4710-057 Braga, Portugal
Interests: smart materials; multifunctional materials; stretchable materials
Special Issues and Collections in MDPI journals
Prof. Dr. Vítor Manuel Gomes Correia
E-Mail Website
Guest Editor
Centro Algoritmi , Universidade do Minho, Campus Azurém, 4800-058 Guimarães, Portugal and Centro de Física, Universidade do Minho, Campus de Gualtar, 4710-057 Braga, Portugal
Interests: printed technologies; smart surfaces; interface electronics
Special Issues and Collections in MDPI journals

Special Issue Information

Dear Colleagues,

Strain and deformation sensors are among the most used in a large variety of devices and applications, ranging from aerospace application to biomedicine. In this scope, novel materials and processing technologies are being developed, allowing the implementation of those sensors in a large variety of novel devices and applications. Thus, nanoscale control of materials and microfabrication techniques are improving precision and integration, whereas printing technologies and novel polymer-based composites allow implementation of flexible and even stretchable sensing solutions. Further, advances strain and deformation sensing materials are at the basis of a wide variety of novel applications in the areas of structural health monitoring and in the biomedical field, among others, as well as to the development of novel concepts of multifunctional and interactive surfaces.

It is our pleasure to invite you to submit original research papers, short communications or state-of-the-art reviews within the scope of this Special Issue. Contributions can range from fundamental properties of materials, their processing and characterization, as well as to innovations in processing technologies or the development of applications.

Prof. Dr. Senentxu Lanceros-Méndez
Dr. Pedro Costa
Prof. Dr. Vítor Manuel Gomes Correia
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • smart materials
  • electronic skin
  • strain sensing
  • multifunctional materials
  • smart surfaces

Published Papers (2 papers)

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Research

Open AccessEditor’s ChoiceArticle
The Effect of Encapsulation on Crack-Based Wrinkled Thin Film Soft Strain Sensors
Materials 2021, 14(2), 364; https://doi.org/10.3390/ma14020364 - 13 Jan 2021
Cited by 1 | Viewed by 453
Abstract
Practical wearable applications of soft strain sensors require sensors capable of not only detecting subtle physiological signals, but also of withstanding large scale deformation from body movement. Encapsulation is one technique to protect sensors from both environmental and mechanical stressors. We introduced an [...] Read more.
Practical wearable applications of soft strain sensors require sensors capable of not only detecting subtle physiological signals, but also of withstanding large scale deformation from body movement. Encapsulation is one technique to protect sensors from both environmental and mechanical stressors. We introduced an encapsulation layer to crack-based wrinkled metallic thin film soft strain sensors as an avenue to improve sensor stretchability, linear response, and robustness. We demonstrate that encapsulated sensors have increased mechanical robustness and stability, displaying a significantly larger linear dynamic range (~50%) and increased stretchability (260% elongation). Furthermore, we discovered that these sensors have post-fracture signal recovery. They maintained conductivity to the 50% strain with stable signal and demonstrated increased sensitivity. We studied the crack formation behind this phenomenon and found encapsulation to lead to higher crack density as the source for greater stretchability. As crack formation plays an important role in subsequent electrical resistance, understanding the crack evolution in our sensors will help us better address the trade-off between high stretchability and high sensitivity. Full article
(This article belongs to the Special Issue Advanced Strain and Deformation Sensing Materials and Applications)
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Open AccessArticle
Textile-Based, Interdigital, Capacitive, Soft-Strain Sensor for Wearable Applications
Materials 2018, 11(5), 768; https://doi.org/10.3390/ma11050768 - 10 May 2018
Cited by 32 | Viewed by 3054
Abstract
The electronic textile area has gained considerable attention due to its implementation of wearable devices, and soft sensors are the main components of these systems. In this paper, a new sensor design is presented to create stretchable, capacitance-based strain sensors for human motion [...] Read more.
The electronic textile area has gained considerable attention due to its implementation of wearable devices, and soft sensors are the main components of these systems. In this paper, a new sensor design is presented to create stretchable, capacitance-based strain sensors for human motion tracking. This involves the use of stretchable, conductive-knit fabric within the silicone elastomer matrix, as interdigitated electrodes. While conductive fabric creates a secure conductive network for electrodes, a silicone-based matrix provides encapsulation and dimensional-stability to the structure. During the benchtop characterization, sensors show linear output, i.e., R2 = 0.997, with high response time, i.e., 50 ms, and high resolution, i.e., 1.36%. Finally, movement of the knee joint during the different scenarios was successfully recorded. Full article
(This article belongs to the Special Issue Advanced Strain and Deformation Sensing Materials and Applications)
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