Organic Light Emitting Diodes: from Materials to Devices
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".
Deadline for manuscript submissions: closed (28 February 2021) | Viewed by 308
Special Issue Editors
Interests: OLED and OPV device processing; Inkjet printing; ESJET printing; lifetime evaluation; barrier technologies and barrier characterization; encapsulation technologies including thin film encapsulation
Special Issue Information
Dear Colleagues,
Organic light emitting diodes (OLEDs) are a new generation of displays and lighting elements and have been the focus of research and development for over 20 years. The first products have been introduced into the market in applications such as displays for smart phones or TVs as well as solid-state lighting. Typically, commercial products are produced via vacuum evaporation technologies. However, solution processing techniques for the production of OLEDs have a high potential due to several advantages over vacuum processing. The benefits of solution processing include less material waste, the potential for up scaling with R2R-technologies as well as fast custom design changes by using digital printing techniques. Progress in material and device development have led to increased stability also of solution processed OLEDs and have raised interest for applications in areas such as automotive wearables or packaging.
In this special issues current trends in material development, OLED stack design as well as processing and possible applications should be addressed.
We invite you to contribute to this special issue. Reviews, full papers and communications are welcome.
Dr. Christine Boeffel
Dr. Armin Wedel
Guest Editors
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Keywords
- Triplett emitting materials
- TADF emitters
- OLED device setup
- Materials for solutions processed OLEDs
- Solution processing of OLEDs
- OLEDs with increased lifetime
- Flexible and adaptable OLEDs
- OLEDs for automotive and textile applications
- Quantum dot LEDs
- Device modelling
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