Materials for Nano/Microelectronic Packaging Applications

Dear Colleagues,

Nano and Micro-Electro-Mechanical Systems (N/MEMS) devices applies to all types of miniaturized devices that are fabricated from silicon- and polymer-based materials using techniques derived from the nano/microelectronics industry. These techniques include isotropic and anisotropic etching, various thin film deposition methods, bonding, masking, and doping techniques employed in integrated circuit (IC) manufacturing.

Integration, packaging and full system feedback of N/MEMS devices are current bottlenecks. For example, the detailed function of a N/MEMS chip is critical to the design of the package, and cost effective packaging and robust reliability are two critical factors for successful commercialization of a N/MEMS device.

This Special Issue aims to introduce contemporary and new generation materials for “Nano/Microelectronic Packaging Applications. Topics include, but are not limited, to:

-Quantum electronic materials as interconnectors in nano/microelectronic industry
-2D (two-dimensional) and transition metal dichalcogenides (TMD) for electronic packaging
-Testing methods and reliability of electronic packaging materials
-Electronic interconnection in biological systems devices (e.g.) biosensors
-Materials for optoelectronic and electro-magnetic devices packaging
-Materials for high-density electronic packaging and interconnection
-Structure–property relations of materials in electronic packing and interconnections
-New materials for electronic packaging
-Computational studies for selecting materials for electronic packing

Prof. Mustafa Yavuz
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.