Research on Wearable Flexible Electronic Materials
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".
Deadline for manuscript submissions: 20 February 2026 | Viewed by 891
Special Issue Editors
Interests: sensors and actuators power harvesting MEMS EAPs; dry etching; surface passivation of III–V semiconductors; thin film deposition and materials integration; plasma–surface interactions; optoelectronic materials and nanostructures
2. LMPGI, High School of Technology, Hassan II University of Casablanca, B.P 8012 Oasis, Casablanca, Morocco
Interests: materials science; synthesis; characterization; modelling and simulation; harvesting energy; environmental science; condensed matter; multiferroic materials; piezoelectric materials
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Wearable and flexible electronic materials are reshaping the future of modern electronics by enabling the creation of lightweight, conformable, and multifunctional devices tailored to next-generation applications in health monitoring, soft robotics, smart textiles, and the Internet of Things (IoT). This Special Issue aims to highlight recent progress and emerging trends in this fast-evolving interdisciplinary field.
We welcome high-quality original research articles, reviews, and perspectives on innovative materials (e.g., organic semiconductors, 2D materials, MXenes, and stretchable polymers), advanced device structures (e.g., flexible transistors, biosensors, and energy harvesters), and scalable, low-temperature fabrication processes compatible with diverse substrates such as polyimide, textiles, biodegradable films, and paper. Particular emphasis will be placed on system-level integration strategies for wireless and self-powered devices that enable the continuous, real-time monitoring of physiological and environmental signals.
This Special Issue also welcomes contributions addressing key challenges such as mechanical stability, signal fidelity, power management, and biocompatibility, as well as theoretical modeling and simulation efforts supporting the development of flexible electronics from lab-scale prototypes to real-world deployment.
Dr. Nabil Chakhchaoui
Dr. Lhaj El Hachemi Omari
Dr. Omar Cherkaoui
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- wearable electronics
- flexible sensors
- stretchable materials
- organic semiconductors
- printed electronics
- wireless monitoring
- MXenes
- energy harvesting
- smart textiles
- biomedical devices
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