Advances in Flexible Thermoelectric Materials and Devices

Dear Colleagues,

Innovation in materials and devices is propelling our thermoelectric community forward, and flexibility is highly desirable when it drives onto the fast lane of microelectronics technology. Nowadays, flexible thermoelectric materials and devices, including power generators and thermoelectric coolers, are quickly evolving in terms of both macroscopy and microscopy. To further the progress in this field, we need to strengthen the research in this emerging area of thermoelectrics by exploring flexible thermoelectric materials, novel thermoelectric interface and electrode materials, developing compatible processing and integration technologies, and extending potential applications.

Within this context, this Special Issue aims to provide a forum for researchers from both academia and industry to share recent advances in this potentially rich field, with special attention to flexible thermoelectric materials, flexible thermoelectric power generators and coolers, computer simulation, and application evaluation.

It is my pleasure to invite you to submit a manuscript to this Special Issue. Full papers, communications, and reviews are all welcome.

Prof. Yubo Luo
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.