Solder Alloys and Metals: From Design to Applications

Dear Colleagues,

The special issue "Solder Alloys and Metals: From Design to Applications" explores the latest advancements in solder materials, covering their design, properties, and real-world applications. As industries demand higher performance, reliability, and sustainability in electronic packaging, power electronics, and structural joining, the development of novel solder alloys becomes crucial. This issue will feature cutting-edge research on lead-free solders, high-temperature alloys, nanostructured solders, and their role in enhancing mechanical, thermal, and electrical performance. Topics include alloy design, microstructural evolution, failure mechanisms, and advanced manufacturing techniques such as additive manufacturing and AI-driven optimization.

Within this context, this Special Issue aims to provide an opportunity for researchers to submit high-quality comprehensive reviews, original research papers, and technical case studies in the field of solder alloys and metals: from design to applications. Specific topics include but are not limited to:

• Advanced alloy design strategies: Development of high-performance solder alloys using computational materials science, CALPHAD modeling, and machine learning approaches
• Improvements in solder performance: Enhancements in mechanical strength, thermal conductivity, and oxidation resistance through alloying and microstructural control
• Lead-free and eco-friendly solder alternatives: Novel compositions and processing techniques for sustainable electronics manufacturing
• Phase transformations and microstructure evolution: Understanding the role of intermetallic compounds and grain refinement on joint integrity and longevity
• High-temperature and high-reliability solder materials: Applications in aerospace, automotive, and power electronics
• Additive manufacturing of solder alloys: 3D printing, laser-based deposition, and hybrid joining techniques
• AI and machine learning in soldering processes: Predictive modeling, defect minimization, and real-time process optimization
• Nano-engineered and composite solder alloys: Enhancing wettability, mechanical properties, and thermal stability with nanoparticles and reinforcements
• Wear-resistant and self-healing solder materials: Innovations in smart materials for extended service life
• Advanced testing and characterization techniques: In-situ monitoring, high-resolution microscopy, and accelerated aging studies for solder joint assessment

We welcome contributions from researchers, engineers, and industry professionals to shape the future of solder alloys, soldering and applications.

Dr. Murali Mohan Cheepu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.