Electronic Packaging Materials and Technology Applications
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".
Deadline for manuscript submissions: 31 August 2024 | Viewed by 5258
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Special Issue Editors
Interests: electronic packaging; solder joint; twinned cu film; transient liquid phase bonding; metal-metal direct bonding; 3dic interconnection; power device packaging; low-temperature alloys; high-entropy alloys; materials characterization; reliability issue
Interests: electronic packaging; electroplating; solar cell; solder joint; metal bonding; low-temperature alloy
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
In light of the escalating demand for advanced electronic devices, the domains of 2.5D/3DIC packaging, power device packaging, and low-temperature application packaging have acquired significant attention. These packaging techniques find application in cutting-edge electronic products such as smart devices, electric vehicles, solar energy converters, 5G equipment, and flexible electronics. Consequently, the development of packaging materials, processes, and applications holds critical importance in addressing human well-being, energy concerns, advanced communication equipment, and biomedical products.
We hereby introduce a Special Issue on "Electronic Packaging Materials and Technology Applications". Our collection contains a wide spectrum of research issues, including electronic packaging, solder joint, twinned Cu film, transient liquid phase bonding, metal-metal direct bonding, 3DIC interconnection, power device packaging, low-temperature alloys, materials characterization, and reliability issues—all relevant to advanced packaging technology. We eagerly anticipate the support and contributions of experts in these fields.
Dr. Yu-An Shen
Prof. Dr. Chih-Ming Chen
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- packaging process
- 2.5D/3DIC packaging
- power electronic packaging
- low-temperature application packaging
- packaging materials
- solder joint
- electroplated film for electronic packaging
- transient liquid phase bonding
- metal&ndash
- metal direct bonding
- reliability analysis in electronic packaging
Planned Papers
The below list represents only planned manuscripts. Some of these manuscripts have not been received by the Editorial Office yet. Papers submitted to MDPI journals are subject to peer-review.
Title: The effect of In concentration and temperature on dissolution and precipitation in Sn-Bi alloys
Authors: Qichao Haoa,
Affiliation: a Nihon Superior Centre for the Manufacture of Electronic Materials, School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, Australia
b Australian Synchrotron, ANSTO, Clayton, VIC 3168, Australia
Abstract: Low temperature solder alloys based on the Sn-Bi system are currently undergoing development to provide the electronics manufacturing industry with a path to lower temperature processes. One of the distinguishing features of these alloys is that there are significant changes in microstructure and crystal lattice parameters at the temperatures to which solder joints are exposed in normal service. Previous studies have shown that a major factor influencing properties at these temperatures is the variable solubility of Bi in the Sn phase. The influence of alloying additions in improving the performance of these alloys is the subject of much research. In this study, in-situ heating synchrotron powder X-ray diffraction (PXRD) was adopted to further investigate the Sn-57wt%Bi-xIn (x=0, 0.2, 0.5, 1, and 3 wt%) alloys during heating and cooling to study the dissolution and precipitation of Bi in Sn and the effect of In. This study revealed that the introduction of In can change the microstructure of the Sn-Bi based alloy and promote the dissolution and precipitation of Bi in the Sn phase making the alloy more homogenous during thermal cycling. In addition, there is an alloy-dependent temperature above which the dissolution speed of Bi in Sn increases significantly and the presence of In lowers this temperature. The results provide a deep insight into the dissolution and precipitation of Bi in the Sn phase in Sn-Bi based solder alloys and the effect of In on this phenomenon. The increased understanding of these phenomena, as provided by these results, is a significant contribution to the database upon which the ongoing effort to improve the reliability of the Sn-Bi based solder alloys is based. This opens a path for the electronics manufacturing industry towards lower temperature processes.