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Advances in Materials for Electromagnetic Shielding and Absorbing
This special issue belongs to the section “Electronic Materials“.
Special Issue Information
Dear Colleagues,
With the rapid development of 5G/6G communications and radar detecting systems, electromagnetic pollution has emerged as a critical challenge. The high integration and high-frequency operation of electronic devices have led to severe risks of electromagnetic leakage, significantly affecting device performance and human health. Therefore, advanced electromagnetic (EM) absorbing and shielding materials—characterized by high efficiency, lightweight, broadband response, and environmental stability—have become essential for addressing these issues. In recent years, novel functional materials such as 2D materials, metamaterials, porous structures, high-entropy materials, and stimuli-responsive materials have shown great promise in EM wave regulation, driving revolutionary advances in EM protection technologies.
Dr. Kaifeng Wang
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- carbon-based nanocomposites
- MOF-derivates
- MXene
- dielectric loss
- conductive network
- EMI shielding
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