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Thin Films and Semiconductor Heterostructures: From Fundamental to Applications

This special issue belongs to the section “Electronic Materials“.

Special Issue Information

Dear Colleagues,

Semiconductor heterostructures are engineered materials composed of different semiconducting materials that are stacked or layered together to bring unique electronic properties. In addition, the thin-film technology provides an ideal tool for the design of nanostructured interfaces offering novel quantum effects. These structures are designed to combine the favorable properties of multiple semiconductors, enabling the development of high-performance electronic devices. Semiconductor heterostructures offer a versatile platform for tailoring the electronic properties of materials, enabling the creation of high-performance electronic devices. Through the strategic combination of different semiconductors and the manipulation of carrier behavior, these heterostructures play a crucial role in advancing technologies such as optoelectronics, quantum computing, and high-speed electronics.

This Special Issue will compile recent developments in the field of thin films and semiconductor heterostructures. The articles presented in this Special Issue will cover various topics, including advanced semiconductor materials and 2D materials, the optimization of deposition methods, thin-film device fabrication, and device characterization techniques. Topics are open to metal oxide thin film deposition and characterization for the development of applications.

Prof. Dr. Martin Weis
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • advanced semiconductors and 2D materials
  • thin-film technology and nanotechnology
  • heterostructures and quantum‒well structures
  • device fabrication techniques
  • novel device characterization techniques

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Materials - ISSN 1996-1944