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Research on Thermal Management of Electronic Equipment and Energy Storage...
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Research on Thermal Management of Electronic Equipment and Energy Storage Devices

A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "J: Thermal Management".

Deadline for manuscript submissions: closed (1 April 2024) | Viewed by 8499

Special Issue Editors

Dr. Liaofei Yin

E-Mail Website
Guest Editor
School of Mechanical, Electronic and Control Engineering, Beijing Jiaotong University, Beijing 100044, China
Interests: phase change heat transfer; thermal management of electronics
Dr. Yidong Fang

E-Mail Website
Guest Editor
School of Energy and Power Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China
Interests: battery thermal management; flow boiling heat transfer
Dr. Zhoujian An

E-Mail Website
Guest Editor
School of Energy and Power Engineering, Lanzhou University of Technology, Lanzhou 730050, China
Interests: thermal management; thermal safety of lithium-ion battery; energy storage materials and technology

Special Issue Information

Dear Colleagues,

All electronic equipment and energy storage devices generate excess heat and thus require thermal management to improve their reliability and prevent premature failure. Thermal management covers all the technical solutions for heat generation, control, and dissipation. Various techniques for thermal management have been developed over the past few decades, including traditional ones (such as forced-air systems and fans, cold-plate cooling, heat pipes, and heat sinks) and novel ones (such as compact heat exchangers, immersion cooling, thermoelectric cooling, and phase change material), as well as recently developed ones (such as micro-/nano-technology and advanced materials). However, there are still some limitations and challenges in this field.

This Special Issue aims to provide a collection of the latest research and findings in the field of thermal management of electronic equipment and energy storage devices. Both research and review papers are welcome. Potential research topics include, but are not limited to, the following:

(1) High/ultra-high heat flux dissipation;

(2) Phase change heat transfer and related thermal control devices;

(3) Thermal interface material for thermal management;

(4) Micro- and nano-level advances in thermal management;

(5) Heat transfer and thermal management in Li-ion cells and battery packs.

Dr. Liaofei Yin
Dr. Yidong Fang
Dr. Zhoujian An
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • heat sinks
  • cold plate
  • forced-air cooling
  • heat pipes
  • vapor chamber
  • immersion cooling
  • thermoelectric cooling
  • microchannel flow boiling
  • phase change heat transfer
  • phase change material
  • thermal interface
  • thermal management

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Published Papers (3 papers)

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Research

17 pages, 7832 KiB  
Article
Enhancement Effect of a Diamond Network on the Flow Boiling Heat Transfer Characteristics of a Diamond/Cu Heat Sink
by Nan Wu, Mingmei Sun, Hong Guo, Zhongnan Xie and Shijie Du
Energies 2023, 16(21), 7228; https://doi.org/10.3390/en16217228 - 24 Oct 2023
Cited by 8 | Viewed by 1598
Abstract
The use of a micro heat sink is an effective means of solving the problem of high-power chip heat dissipation. Diamond/Cu composites exhibit high thermal conductivity and a linear thermal expansion coefficient that is compatible with semiconductor materials, rendering them ideal micro heat [...] Read more.
The use of a micro heat sink is an effective means of solving the problem of high-power chip heat dissipation. Diamond/Cu composites exhibit high thermal conductivity and a linear thermal expansion coefficient that is compatible with semiconductor materials, rendering them ideal micro heat sink materials. The aim of this study was to fabricate diamond/Cu and Cu separately as heat sinks and subject them to flow boiling heat transfer experiments. The results indicate that the diamond/Cu heat sink displayed a decrease in wall superheat of 10.2–14.5 °C and an improvement in heat transfer coefficient of 38–51% compared with the Cu heat sink under identical heat fluxes. The heat sink also exhibits enhanced thermal uniformity. Secondary diamond particles are incorporated into the gaps of the main diamonds, thereby constructing a three-dimensional heat conduction network within the composite material. The diamond network enhances the internal heat flux of the material while also creating more nucleation sites on the surface. These increase the boiling intensity of the diamond/Cu heat sink, leading to better heat transfer performance. By combining the transient thermal model with computational fluid dynamics, a heat transfer model based on the diamond/Cu heat sink is proposed. The efficient heat dissipation capability of diamond/Cu heat sinks can lower the working temperature of microelectronic devices, thereby improving device performance and reliability during operation. Full article
(This article belongs to the Special Issue Research on Thermal Management of Electronic Equipment and Energy Storage Devices)
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21 pages, 6933 KiB  
Article
Conjugate Heat Transfer Modeling of a Cold Plate Design for Hybrid-Cooled Data Centers
by Aras Dogan, Sibel Yilmaz, Mustafa Kuzay, Dirk-Jan Korpershoek, Jeroen Burks and Ender Demirel
Energies 2023, 16(7), 3088; https://doi.org/10.3390/en16073088 - 28 Mar 2023
Viewed by 3624
Abstract
Liquid-cooled servers can be deployed to reduce the energy consumption and environmental footprint of hybrid-cooled data centers. A computational fluid dynamics (CFD) model can bring extremely useful insights and results for thermal simulations of air- and liquid-cooled servers in a single environment. In [...] Read more.
Liquid-cooled servers can be deployed to reduce the energy consumption and environmental footprint of hybrid-cooled data centers. A computational fluid dynamics (CFD) model can bring extremely useful insights and results for thermal simulations of air- and liquid-cooled servers in a single environment. In this study, a conjugate heat transfer (CHT) numerical model is developed and validated with experimental data to simulate heat transfer from the CPU to the air and cold plate considering the effect of thermal paste. The cooling performance of an in-house developed cold plate design is thoroughly investigated via the validated CHT model. A dataset containing one hundred samples of various flow, thermal and workload conditions was generated using the Latin hypercube sampling (LHS) method, which was further utilized in the series of CHT simulations. Finally, a novel empirical equation is proposed for the prediction of heat transfer from the CPU to the air. The accuracy of the proposed equation is confirmed by comparing estimated and simulated results for a test dataset. A thermal analysis of a rack containing air and liquid-cooled servers is performed using the presented approach. The simulation results reveal that the proposed compact model can be used reliably for the thermal simulation of a hybrid-cooled data center. Full article
(This article belongs to the Special Issue Research on Thermal Management of Electronic Equipment and Energy Storage Devices)
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11 pages, 3395 KiB  
Article
Heat Transfer of Water Flow Boiling in Nanostructured Open Microchannels
by Liaofei Yin, Zhonglin Yang, Kexin Zhang, Yingli Xue and Chao Dang
Energies 2023, 16(3), 1303; https://doi.org/10.3390/en16031303 - 26 Jan 2023
Cited by 4 | Viewed by 2222
Abstract
In recent years, the open microchannel has drawn increasing interest, but severe local dryout limited the heat transfer capability of flow boiling. It was anticipated that nanostructures with exceptional capillary wicking abilities would overcome this problem. In this study, blade-like CuO nanostructures were [...] Read more.
In recent years, the open microchannel has drawn increasing interest, but severe local dryout limited the heat transfer capability of flow boiling. It was anticipated that nanostructures with exceptional capillary wicking abilities would overcome this problem. In this study, blade-like CuO nanostructures were created in the copper open microchannels to experimentally investigate water flow boiling. Experiments were carried out in nanostructured open microchannels (NMCs), and smooth-surface open microchannels (SMCs), as a comparison, were examined under identical operating conditions. Four main flow patterns, including bubbly flow, slug flow, and two kinds of stratified flow, dominated successively in NMCs and SMCs. Although the flow patterns were similar in NMCs and SMCs, the heat transfer coefficient (HTC) of flow boiling was greatly enhanced by nanostructures under conditions of medium and high heat flux, while the nanostructures’ influence on HTC was unnoticeable at low heat flux. At medium and high heat fluxes, the dependence of HTC on heat flux and flow rate indicated the joint contribution of nucleate boiling mechanism and convective evaporation mechanism to heat transfer. The enhanced effect of nanostructures on nucleate boiling and convective evaporation became more prominent as heat flux increased, leading to a higher HTC in NMCs than in SMCs at higher heat flux conditions. Full article
(This article belongs to the Special Issue Research on Thermal Management of Electronic Equipment and Energy Storage Devices)
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