Multi-Modal Data Analysis

Dear Colleagues,

The rapid expansion of data across diverse domains such as computer vision, natural language processing, and geospatial sensing has elevated the importance of multi-modal data analysis, where information from multiple sources is integrated to build more intelligent, context-aware systems. By combining complementary modalities such as RGB imagery, multispectral images, hyperspectral images, LiDAR data, SAR data, and text, multi-modal approaches enable deeper understanding and improved decision-making in real-world applications.

This Special Issue aims to bring together cutting-edge research at the intersection of signal processing and machine learning to address challenges in multi-modal data integration. These include cross-modal alignment, robustness to missing or limited data, heterogeneous feature fusion, and computational scalability. We invite high-quality submissions that advance theoretical foundations, propose new architectures or algorithms, and showcase applications of multi-modal learning.

Topics of interest include, but are not limited to, the following:

• Multi-modal deep learning and representation alignment;
• Data fusion techniques for heterogeneous data;
• Cross-modal retrieval, generation, and knowledge transfer;
• Handling noisy, sparse, or missing modalities in real-world data;
• Applications in Earth observation, environmental sustainability, and smart cities;
• Multi-modal foundation models and efficient adaptation;
• Benchmark datasets and reproducible evaluation for multi-modal tasks.

This Special Issue welcomes the submission of both original research articles and comprehensive reviews. We especially encourage interdisciplinary contributions that demonstrate the value of multi-modal analysis.

Dr. Jiaqi Yang
Dr. Chuan Fu
Dr. Haonan Guo
Dr. Chaonan Ji
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.