Innovative Applications of Semiconductor Materials and Devices

Dear Colleagues,

The semiconductor industry is currently navigating a critical transition into the post-Moore era, where geometric scaling alone is no longer sufficient to drive performance gains. This Special Issue, "Innovative Applications of Semiconductor Materials and Devices," focuses on the intersection of emerging material science and advanced device architectures. The scope encompasses the entire value chain—from novel low-dimensional materials (such as carbon nanotubes and 2D materials) and advanced silicon-based logic devices (FinFET, GAAFET, BSPDN, and CFET) to their integration into functional circuits.

The primary purpose of this collection is to address the urgent challenges of energy efficiency, operating frequency, and manufacturing complexity facing modern electronics. By highlighting breakthroughs in Design–Technology Co-Optimization (DTCO), this issue aims to showcase how process innovations can be translated into system-level benefits for high-demand applications, including 5G/6G Radio Frequency (RF) front-ends and neuromorphic Compute-in-Memory (CIM) architectures.

This Special Issue serves as a dedicated platform to highlight the synergy between emerging material science and circuit applications. By focusing on the practical implementation of novel devices, this collection aims to complement foundational research with a strong emphasis on Design–Technology Co-Optimization and system-level integration. We aim to include contributions that directly connect underlying physics in devices to performance metrics in high-demand applications, thereby enriching the technical literature with a vertically integrated perspective that benefits both process engineers and circuit designers.

Dr. Yanxia Lin
Guest Editor

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