Fault Identification and Prognosis for Electromechanical Systems

Dear Colleagues,

Fault identification and failure prognosis for electromechanical systems have become very important for most industrial sectors and for academic research. Fault identification includes fault detection, fault isolation, estimation of failure modes of faults, and fault severity estimation.

This Special Issue’s scope is on novel research and developments, related to:

• Fault detection;
• Fault isolation;
• Estimation of failure modes of faults;
• Fault severity estimation;
• Failure prognosis.

The main challenges for these areas are as follows:

• Multiclass weak fault detection and fault isolation;
• Effect of variable system operating conditions on fault identification and failure prognosis;
• Increase of accuracy of fault severity estimation and estimation of the remaining useful life before failure;
• Effects of physics of fault/failure on fault identification and failure prognosis;
• Automation of on-line fault identification and failure prognosis.

Addressing these challenges requires novel research and developments, related to data analysis in frequency and multifrequency domains, fault detection, machine learning and pattern recognition, fault severity estimation, failure mode analysis, and analysis of physics of fault/failure mechanisms in materials and rotating equipment and stress analysis.  

The following main topics, applied for electromechanical systems, describe this SI:

• Fault identification;
• Fault detection;
• Fault isolation and fault severity estimation;
• Failure modes of faults;
• Failure prognosis and estimation of the remaining useful life before failure;
• Data analysis in frequency and multifrequency domains;
• Pattern recognition and machine learning;
• Physics of fault/failure.

This Special Issue will not cover non-novel “case study” papers and papers, related to software fault prediction. Potential authors need to make clear statements of paper novelties, which should be based on comprehensive state-of-the art reviews.

Prof. Dr. Len Gelman
Prof. Dr. Shuncong Zhong
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• fault identification
• fault detection
• fault isolation and fault severity estimation
• failure modes of faults
• failure prognosis and estimation of the remaining useful life before failure
• data analysis in frequency and multifrequency domains
• pattern recognition and machine learning
• physics of fault/failure