Special Issue "Engineering Metamaterials"

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microwave and Wireless Communications".

Deadline for manuscript submissions: 31 August 2019

Special Issue Editor

Guest Editor
Dr. Stanislav Maslovski

Instituto de Telecomunicações, Departamento de Engenharia Electrotécnica e de Computadores, Universidade de Coimbra - Polo II, 3030-291 Coimbra, Portugal
Website | E-Mail
Interests: electromagnetics of complex media and metamaterials; metamaterials with pronounced spatial dispersion; negative refraction and subwavelength imaging; quantum-electromagnetic effects in metamaterials; super-Planckian radiative heat transfer in metamaterials

Special Issue Information

Dear Colleagues,

A couple of decades have passed since the advent of electromagnetic metamaterials. Although the research on artificial microwave materials dates back to the middle of the 20th century, the most prominent development in the electromagnetics of artificial media has happened in the new millennium. In the last decade, the electromagnetics of one-, two-, and three-dimensional metamaterials acquired robust characterization and design tools. Novel fabrication techniques have been developed. Many exotic effects involving metamaterials and metasurfaces, which initially belonged in a scientist’s lab, are now well understood by practicing engineers. Therefore, it is time for the metamaterial concepts to become a designer’s tools of choice in the landscape of electronics, microwaves, and photonics.

This Special Issue on “Engineering Metamaterials” focuses on the theory and applications of electromagnetic metamaterials, metasurfaces, and metamaterial transmission lines as the building blocks of present-day and future electronic, photonic, and microwave devices.

Submissions are invited on topics including, but not limited to:

  • Active, smart, and controllable metamaterials,
  • Metamaterials for green energy,
  • Metamaterials for radiative heat transfer,
  • Metamaterials for biomedical applications,
  • Fractal and topological metamaterials,
  • Metamaterials for absorbers and energy harvesters,
  • Metamaterial antennas and sensors,
  • Metamaterials for wave front and polarization control,
  • Metamaterial waveguides and transmission lines,
  • Metamaterial-inspired filters, phase shifters and delay lines.

The Special Issue Best Paper Award (300 CHF, a certificate, and a free publication opportunity for the author’s next submission to Electronics) will be selected from this Special Issue by an evaluation panel consisting of the editors and leading experts in the field.

Dr. Stanislav Maslovski
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers (3 papers)

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Research

Open AccessArticle
Analytical Modeling of Metamaterial Differential Transmission Line Using Corrugated Ground Planes in High-Speed Printed Circuit Boards
Electronics 2019, 8(3), 299; https://doi.org/10.3390/electronics8030299
Received: 11 January 2019 / Revised: 28 February 2019 / Accepted: 1 March 2019 / Published: 7 March 2019
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Abstract
An analytical model for metamaterial differential transmission lines (MTM-DTLs) with a corrugated ground-plane electromagnetic bandgap (CGP-EBG) structure in high-speed printed circuit boards is proposed. The proposed model aims to efficiently and accurately predict the suppression of common-mode noise and differential signal transmission characteristics. [...] Read more.
An analytical model for metamaterial differential transmission lines (MTM-DTLs) with a corrugated ground-plane electromagnetic bandgap (CGP-EBG) structure in high-speed printed circuit boards is proposed. The proposed model aims to efficiently and accurately predict the suppression of common-mode noise and differential signal transmission characteristics. Analytical expressions for the four-port impedance matrix of the CGP-EBG MTM-DTL are derived using coupled-line theory and a segmentation method. Converting the impedance matrix into mixed-mode scattering parameters enables obtaining common-mode noise suppression and differential signal transmission characteristics. The comprehensive evaluations of the CGP-EBG MTM-DTL using the proposed analytical model are also reported, which is validated by comparing mixed-mode scattering parameters Scc21 and Sdd21 with those obtained from full-wave simulations and measurements. The proposed analytical model provides a drastic reduction of computation time and accurate results compared to full-wave simulation. Full article
(This article belongs to the Special Issue Engineering Metamaterials)
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Open AccessArticle
Two-Dimensional Imaging of Permittivity Distribution by an Activated Meta-Structure with a Functional Scanning Defect
Electronics 2019, 8(2), 239; https://doi.org/10.3390/electronics8020239
Received: 31 January 2019 / Revised: 14 February 2019 / Accepted: 18 February 2019 / Published: 20 February 2019
Cited by 1 | PDF Full-text (6777 KB) | HTML Full-text | XML Full-text
Abstract
A novel 2D imaging method for permittivity imaging using a meta-structure with a functional scanning defect is proposed, working in the millimeter wave-range. The meta-structure we used here is composed of a perforated metal plate with subwavelength-holes and a needle-like conductor that can [...] Read more.
A novel 2D imaging method for permittivity imaging using a meta-structure with a functional scanning defect is proposed, working in the millimeter wave-range. The meta-structure we used here is composed of a perforated metal plate with subwavelength-holes and a needle-like conductor that can scan two-dimensionally just beneath the plate. The metal plate, which is referred to as a metal hole array (MHA) in this study, is known as a structure supporting propagation of spoof surface plasmon polaritons (SSPPs). High-frequency waves with frequencies higher than microwaves, including SSPPs, have the potential to detect signals from inner parts embedded beneath solid surfaces such as living cells or organs under the skin, without physical invasion, because of the larger skin depth penetration of millimeter wave-bands than optical wave-bands. Focused on activated SSPPs, the localized distortion of SSPP modes on an MHA is used in the proposed method to scan the electromagnetic properties of the MHA with a needle-like conductor (conductive probe), which is a kind of active defect-initiator. To show the validity of the proposed method, electromagnetic analyses of the localized distortions of wave fields were performed, and one- and two-dimensional imaging experiments were conducted with the aim of detecting both conductive and dielectric samples. The analytical results confirmed the localized distortion of the electric field distribution of SSPP modes and also indicated that the proposed method has scanning ability. In experimental studies, the detection of conductive and dielectric samples was successful, where the detected dielectrics contained pseudo-biological materials, with an accuracy on the order of millimeters. Finally, a biomedical diagnosis in the case of a rat lung is demonstrated by using the experimental system. These results indicate that the proposed method may be usable for non-invasive and low-risk biomedical diagnosis. Full article
(This article belongs to the Special Issue Engineering Metamaterials)
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Open AccessArticle
Identifying Near-Perfect Tunneling in Discrete Metamaterial Loaded Waveguides
Electronics 2019, 8(1), 84; https://doi.org/10.3390/electronics8010084
Received: 25 October 2018 / Revised: 20 December 2018 / Accepted: 3 January 2019 / Published: 11 January 2019
PDF Full-text (5592 KB) | HTML Full-text | XML Full-text | Supplementary Files
Abstract
Mu-negative and epsilon-negative loaded waveguides taken on their own are nominally cut-off. In ideal circumstances, and when paired in the correct proportions, tunneling will occur. However, due to losses and constraints imposed by finite-sized constituent elements, the ability to experimentally demonstrate tunneling may [...] Read more.
Mu-negative and epsilon-negative loaded waveguides taken on their own are nominally cut-off. In ideal circumstances, and when paired in the correct proportions, tunneling will occur. However, due to losses and constraints imposed by finite-sized constituent elements, the ability to experimentally demonstrate tunneling may be hindered. A tunnel identification method has been developed and demonstrated to reveal tunneling behavior that is otherwise obscured. Using ABCD (voltage-current transmission) matrix formulation, the S-parameters of the mu-negative/epsilon-negative loaded waveguide junction is combined with S-parameters of an epsilon-negative loaded waveguide. The method yields symmetric scattering matrices, which allows the effect of losses to be removed to provide yet clearer identification of tunneling. Full article
(This article belongs to the Special Issue Engineering Metamaterials)
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