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Electronics
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Advanced Optoelectronic Sensing Technology
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Advanced Optoelectronic Sensing Technology

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Optoelectronics".

Deadline for manuscript submissions: 15 December 2025 | Viewed by 264

Special Issue Editors

Dr. Longhuang Tang

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Guest Editor
Institute of Fluid Physics, China Academy of Engineering Physics, Mianyang 622150, China
Interests: optical terahertz generation; terahertz spectroscopy; nonlinear frequency conversion
Special Issues, Collections and Topics in MDPI journals
Dr. Jia Shi

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Guest Editor
School of Electronic and Information Engineering, Tiangong University, Tianjin 300387, China
Interests: microwave and terahertz photonics; optical fiber sensors
Special Issues, Collections and Topics in MDPI journals
Dr. Yang Liu

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Guest Editor
Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing, China
Interests: optical terahertz generation; nonlinear frequency conversion; laser technology
Special Issues, Collections and Topics in MDPI journals
Dr. Chao Yan

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Guest Editor
School of Precision Instruments and Optoelectronics Engineering, Institute of Laser and Optoelectronics, Tianjin University, Tianjin 300072, China
Interests: advanced photoelectric detection technique; advanced sensing and imaging (bio-inspired, computational, AI-driven)

Special Issue Information

Dear Colleagues,

Modern advanced industry equipment relies heavily on advanced sensing technologies to support its rapid development. In the field of equipment testing and monitoring, there has been a noticeable shift from traditional single-dimensional contact electronic sensors to innovative multi-dimensional non-contact optoelectronic sensors. This Special Issue aims to delve into the principles, technologies, and systems of advanced optoelectronic sensors, with a specific focus on their application in the complex working environments, characterized by high temperatures, high pressures, and high speeds. Original research articles and reviews are invited for this Special Issue. Potential research areas may include, but are not limited to, the following: the theoretical and experimental advancements of sensors based on optoelectronic, microwave photonics, and terahertz optoelectronic for precise measurements of displacement, distance, velocity, vibration, temperature, pressure, dynamic stress, and more. Given that validating suppositions often require cross-checking, the use of combined approaches is also encouraged.

We look forward to receiving your contributions.

Dr. Longhuang Tang
Dr. Jia Shi
Dr. Yang Liu
Dr. Chao Yan
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • optical fiber sensors
  • microwave photonic sensors
  • terahertz optoelectronic sensors
  • extreme environments
  • optoelectronic sensors
  • dynamic measurement
  • optoelectronic systems and applications
  • modern advanced industry equipment
  • equipment testing and applications
  • precision measurement in flight testing

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Published Papers (1 paper)

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Research

10 pages, 3292 KiB  
Article
Application of Highly Spatially Resolved Area Array Velocity Measurement in the Cracking Behavior of Materials
by Long Chen, Longhuang Tang, Heli Ma, Wei Gu, Cangli Liu, Xing Jia, Tianjiong Tao, Shenggang Liu, Yongchao Chen, Xiang Wang, Jian Wu, Chengjun Li and Jidong Weng
Electronics 2025, 14(9), 1732; https://doi.org/10.3390/electronics14091732 - 24 Apr 2025
Viewed by 141
Abstract
Understanding microscale dynamic behavior in heterogeneous materials (e.g., polycrystalline or semiconductor systems) under impact loading requires diagnostics capable of resolving ~100 μm features. This study introduces a 19-core fiber-optic array probe with 100 μm spatial resolution, integrated with DISAR velocimetry on a light [...] Read more.
Understanding microscale dynamic behavior in heterogeneous materials (e.g., polycrystalline or semiconductor systems) under impact loading requires diagnostics capable of resolving ~100 μm features. This study introduces a 19-core fiber-optic array probe with 100 μm spatial resolution, integrated with DISAR velocimetry on a light gas gun platform, enabling two-dimensional continuous measurement of free-surface velocity. The system overcomes limitations of conventional single-point methods (e.g., VISAR’s millimeter-scale resolution and reflectivity constraints) by achieving nanosecond temporal resolution and sub-nanometer displacement sensitivity. Under ~8 GPa impact loading, the probe captures spatiotemporal velocity heterogeneity in polycrystalline materials, including localized pull-back signals and periodic oscillations caused by shock wave reflections at microstructural interfaces. These observations reveal dynamic processes such as damage initiation and evolution, directly linking velocity profiles to microscale material response. The results provide experimental evidence of how grain-scale defects influence shock propagation and energy dissipation, advancing predictive models for extreme-condition material performance. This high-resolution, multi-channel approach offers a paradigm shift in diagnosing heterogeneous material behavior under high-strain-rate loading. Full article
(This article belongs to the Special Issue Advanced Optoelectronic Sensing Technology)
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