Terahertz Electronics for Sensing and Communications

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microwave and Wireless Communications".

Deadline for manuscript submissions: 15 November 2024 | Viewed by 511

Special Issue Editor


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Guest Editor
Division of Electronics and Electrical Engineering, Dongguk University, Seoul 04620, Republic of Korea
Interests: millimeter-wave/(sub) terahertz integrated circuits; power amplifiers; phased array systems; radars
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Special Issue Information

Dear Colleagues,

We are delighted to announce this upcoming Special Issue of Electronics entitled "Terahertz Electronics for Sensing and Communications", and we cordially invite researchers and experts in the field to contribute their valuable work. The continuous development of terahertz technology has opened new possibilities in various applications, particularly in the realms of sensing and communications. This Special Issue aims to explore the latest advancements, challenges, and applications of terahertz electronics, shedding light on their significance and potential impact.

(1) Introduction:

Terahertz frequencies, spanning from 0.1 to 10 THz, have garnered substantial attention due to their unique properties that enable diverse applications. The ability to penetrate non-conductive materials and the non-ionizing nature of terahertz radiation make it an ideal candidate for various fields, including medical imaging, security screening, material characterization, and ultrafast wireless communications. Consequently, researchers have been actively investigating terahertz electronics to leverage their capabilities for sensing and communication purposes.

The importance of this research area lies in its potential to revolutionize various industries. For instance, terahertz imaging can enable non-destructive testing and inspection in manufacturing, while terahertz communication holds the promise of ultra-high-speed, secure, and low-latency wireless data transfer. Moreover, terahertz sensing has the potential to uncover hidden information from various substances and structures, leading to advancements in fields such as healthcare, environmental monitoring, and cultural heritage preservation.

(2) Aim of the Special Issue:

The primary aim of this Special Issue is to provide a comprehensive platform for researchers to present original research articles and reviews that delve into the realm of terahertz electronics for sensing and communications. By doing so, we seek to foster an environment of collaboration and knowledge sharing, ultimately accelerating the progress of this field. Our goal is to bring together leading experts and newcomers to contribute their insights, methodologies, and findings, which will help advance the understanding and application of terahertz technology in the sensing and communication domains.

This Special Issue perfectly aligns with the scope of Electronics, a journal known for its high-quality publications in the field of electronic science and technology.  By featuring this topic, we aim to further enhance the journal's impact in the field and foster interdisciplinary collaborations among researchers from diverse backgrounds.

(3) Suggested Themes:

While we welcome contributions on a wide array of topics related to "Terahertz Electronics for Sensing and Communications", some suggested themes for potential submissions include:

- Novel terahertz transceiver designs and architectures;

- Advancements in terahertz antenna technologies;

- Signal processing techniques for terahertz communication systems;

- Terahertz transceivers for wireless communication applications;

- Terahertz imaging systems and applications;

- Terahertz spectroscopy for material characterization;

- Terahertz sensing in biomedical and environmental applications;

- Integration of terahertz transceivers in practical devices and systems;

- Emerging terahertz devices and components;

We are looking forward to receiving your valuable contributions to this Special Issue.

Dr. Jung-Dong Park
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • terahertz
  • integrated circuits
  • transmitter
  • receiver
  • communications
  • sensors

Published Papers (1 paper)

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Research

10 pages, 3987 KiB  
Article
A High-Speed V-Band Distributed OOK Modulator in 65 nm CMOS
by Zubair Mehmood and Munkyo Seo
Electronics 2024, 13(8), 1528; https://doi.org/10.3390/electronics13081528 - 17 Apr 2024
Viewed by 299
Abstract
This paper presents a high-speed V-band on-off keying (OOK) modulator in 65 nm CMOS based on distributed transmission lines architecture. The high-speed operation of the proposed OOK modulator is attained by distributing a single large switching transistor into smaller units. The effects of [...] Read more.
This paper presents a high-speed V-band on-off keying (OOK) modulator in 65 nm CMOS based on distributed transmission lines architecture. The high-speed operation of the proposed OOK modulator is attained by distributing a single large switching transistor into smaller units. The effects of parasitic capacitances of each small switch are mitigated by series inductors, forming an artificial transmission line. The switch size and the number of stages are optimized for a reasonable balance between insertion loss and isolation. Small signal measurement of the OOK modulator reveals 3.8 dB insertion loss and 20.5 dB isolation at 60 GHz, with <5 dB insertion loss and >16 dB on-off ratio from 50 GHz to 70 GHz. Testing with a modulation setup shows the modulator is fully functional up to 5 Gbps at a 60 GHz carrier. Limitations of the test setup prevent modulation testing at >5 Gbps. The fabricated modulator does not consume any DC power and has an active footprint of 0.025 mm2. Full article
(This article belongs to the Special Issue Terahertz Electronics for Sensing and Communications)
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