Analog/RF Integrated Circuits and System Design for Neural Interface Applications

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Bioelectronics".

Deadline for manuscript submissions: closed (31 October 2021) | Viewed by 3267

Special Issue Editor


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Guest Editor
Department of Electrical and Information Engineering, Seoul National University of Science and Technology (Seoultech), Seoul 01811, Korea
Interests: CMOS RF/analog IC and system design for biomedical applications

Special Issue Information

Dear Colleagues,

In the last few decades, many advancements have taken place in the research on the brain–machine interface (BMI) technologies to monitor and treat neurophysiological disorders, with the ultimate goal of improving the understanding of the brain and its complex functions. Multi-channel multi-modal bidirectional neural interface system-on-chips (SoC) with neural recording, stimulation, digital signal processing, wireless power delivery and management, and wireless communication capabilities are being developed, while meeting the technical challenges imposed by the human brain. Requirements such as small form factor, ultra-low power consumption, and artifact suppression or cancellation are a few of the challenges that need to be addressed and resolved by the overall system at both the architectural and circuit levels during the realization process.  

The topics of interest for this Special Issue include the design and implementation of neural interface SoCs, as well as the works related to individual analog and RF IC design building blocks for BMI applications using CMOS technologies.

Prof. Dr. Hyouk-Kyu Cha
Guest Editor

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Keywords

  • Brain–machine interface (BMI)
  • Bidirectional neural interface system-on-chip (SoC)
  • Analog front-end
  • Neural recording
  • Low-noise neural amplifier
  • Low-power analog-to-digital converter (ADC)
  • Neural stimulation
  • Wireless power conversion and management
  • Low-power wireless transceiver
  • Stimulation artifact
  • Charge balancing
  • Action potential (AP) and local field potential (LFP)
  • Electrocorticography (ECoG)
  • Electroencephalography (EEG)

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Published Papers (1 paper)

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Research

20 pages, 4049 KiB  
Article
Sub-Milliwatt Transceiver IC for Transcutaneous Communication of an Intracortical Visual Prosthesis
by Adedayo Omisakin, Rob Mestrom, Georgi Radulov and Mark Bentum
Electronics 2022, 11(1), 24; https://doi.org/10.3390/electronics11010024 - 22 Dec 2021
Cited by 2 | Viewed by 2785
Abstract
An intracortical visual prosthesis plays a vital role in partially restoring the faculty of sight in visually impaired people. Reliable high date rate wireless links are needed for transcutaneous communication. Such wireless communication should receive stimulation data (downlink) and send out neural recorded [...] Read more.
An intracortical visual prosthesis plays a vital role in partially restoring the faculty of sight in visually impaired people. Reliable high date rate wireless links are needed for transcutaneous communication. Such wireless communication should receive stimulation data (downlink) and send out neural recorded data (uplink). Hence, there is a need for an implanted transceiver that is low-power and delivers sufficient data rate for both uplink and downlink. In this paper, we propose an integrated circuit (IC) solution based on impulse radio ultrawideband using on-off keying modulation (OOK IR-UWB) for the uplink transmitter, and binary phase-shift keying (BPSK) with sampling and digital detection for the downlink receiver. To make the solution low-power, predominantly digital components are used in the presented transceiver test-chip. Current-controlled oscillators and an impulse generator provide tunability and complete the on-chip integration. The transceiver test-IC is fabricated in 180 nm CMOS technology and occupies only 0.0272 mm2. At 1.3 V power supply, only 0.2 mW is consumed for the BPSK receiver and 0.3 mW for the IR-UWB transmitter in the transceiver IC, while delivering 1 Mbps and 50 Mbps, respectively. Our link budget analysis shows that this test chip is suitable for intracortical integration considering the future off-chip antennas/coils transcutaneous 3–7 mm communication with the outer side. Hence, our work will enable realistic wireless links for the intracortical visual prosthesis. Full article
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