You are currently viewing a new version of our website. To view the old version click .

Micromachines, Volume 2, Issue 1

March 2011 - 4 articles

  • Issues are regarded as officially published after their release is announced to the table of contents alert mailing list .
  • You may sign up for email alerts to receive table of contents of newly released issues.
  • PDF is the official format for papers published in both, html and pdf forms. To view the papers in pdf format, click on the "PDF Full-text" link, and use the free Adobe Reader to open them.

Articles (4)

  • Article
  • Open Access
10 Citations
9,443 Views
13 Pages

Self-Assembly of Microscale Parts through Magnetic and Capillary Interactions

  • Christopher J. Morris,
  • Brian Isaacson,
  • Michael D. Grapes and
  • Madan Dubey

1 March 2011

Self-assembly is a promising technique to overcome fundamental limitations with integrating, packaging, and general handling of individual electronic-related components with characteristic lengths significantly smaller than 1 mm. Here we describe the...

  • Article
  • Open Access
28 Citations
11,771 Views
20 Pages

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration

  • Takafumi Fukushima,
  • Takayuki Konno,
  • Eiji Iwata,
  • Risato Kobayashi,
  • Toshiya Kojima,
  • Mariappan Murugesan,
  • Ji-Chel Bea,
  • Kang-Wook Lee,
  • Tetsu Tanaka and
  • Mitsumasa Koyanagi

18 February 2011

New surface mounting and packaging technologies, using self-assembly with chips having cavity structures, were investigated for three-dimensional (3D) and hetero integration of complementary metal-oxide semiconductors (CMOS) and microelectromechanica...

  • Review
  • Open Access
27 Citations
17,044 Views
32 Pages

Self-Assembly in Micro- and Nanofluidic Devices: A Review of Recent Efforts

  • Hwa Seng Khoo,
  • Cheng Lin,
  • Shih-Hao Huang and
  • Fan-Gang Tseng

11 February 2011

Self-assembly in micro- and nanofluidic devices has been the focus of much attention in recent years. This is not only due to their advantages of self-assembling with fine temporal and spatial control in addition to continuous processing that is not...

  • Article
  • Open Access
2 Citations
7,711 Views
16 Pages

Controlling Interfacial Adhesion of Self-Assembled Polypeptide Fibrils for Novel Nanoelectromechanical System (NEMS) Applications

  • Narender Rana,
  • Christopher Kossow,
  • Eric T. Eisenbraun,
  • Robert E. Geer and
  • Alain E. Kaloyeros

17 January 2011

The relative adhesion of two genetically engineered polypeptides termed as H6-(YEHK)x21-H6 and C6-(YEHK)X21-H6 has been investigated following growth and self-assembly on highly oriented pyrolytic graphite (HOPG), SiO2, Ni, and Au substrates to study...

Get Alerted

Add your email address to receive forthcoming issues of this journal.

XFacebookLinkedIn
Micromachines - ISSN 2072-666X