Meet Us at the 2025 International Conference on Electronics Packaging and iMAPs All Asia Conference (ICEP-IAAC 2025), 15–19 April 2025, Nagano, Japan
MDPI will be attending the 2025 International Conference on Electronics Packaging and iMAPs All Asia Conference (ICEP-IAAC 2025) in Nagano, Japan, which will take place from 15 to 19 April 2025. ICEP is Japan’s largest international conference on electronic packaging, attracting more than 360 attendees and hosting roughly 35 technical sessions. The conference comprises technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless components, interconnections, materials and processes, optoelectronics, power electronics integration, and thermal management.
The following MDPI journals will be represented at the conference:
- Electronics;
- Applied Sciences;
- Chips;
- Hardware;
- Journal of Experimental and Theoretical Analyses;
- Journal of Low Power Electronics and Applications;
- Journal of Sensor and Actuator Networks;
- Materials;
- Micromachines;
- Technologies.
If you are planning to attend the above conference, please visit our booth. Our delegates look forward to meeting you in person and answering any questions that you may have. For more information about this conference, please visit the following website: https://www.jiep.or.jp/icep/.