Modelling, Simulation and Optimization of Advanced Thermal Systems for Engineering Applications

A special issue of Modelling (ISSN 2673-3951).

Deadline for manuscript submissions: 31 December 2026 | Viewed by 354

Editors


E-Mail Website
Guest Editor
Department of Energy, Politecnico di Milano, Via Lambruschini 4, 20156 Milan, Italy
Interests: computational fluid dynamics; evaporative cooling; heat pipes; numerical modeling; wettability

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Guest Editor
Building Energy Research Center, Tsinghua University, Beijing 100084, China
Interests: absorption heat pump; absorption heat exchanger; evaporative cooling; data center cooling and waste heat recovery; heat storage; seawater desalination

Special Issue Information

Dear Colleagues,

We are pleased to invite contributions to the Special Issue, entitled “Modelling, Simulation and Optimization of Advanced Thermal Systems for Engineering Applications”.

Advanced thermal systems are increasingly characterized by strong multi-physics interactions, complex geometries, and stringent performance requirements across a wide range of engineering applications. A reliable assessment of their behaviour depends on robust modelling frameworks and numerical simulation techniques capable of capturing coupled thermo-fluid and heat transfer processes. In this scenario, advanced computational approaches play a crucial role in enabling accurate performance prediction, systematic analysis of design parameters, and optimization of system configurations under realistic operating conditions.

This Special Issue aims to collect high-quality research articles and review papers addressing recent developments in modelling, simulation, and optimization techniques applied to thermal systems. Contributions focusing on computational fluid dynamics, multi-physics modelling, numerical methods, and advanced simulation frameworks are particularly welcome. We also encourage the submission of studies dealing with design optimization and performance enhancement in areas such as innovative heat exchangers and thermal management of electronic devices.

By bringing together methodological advances and practical case studies, this Special Issue seeks to provide a comprehensive overview of current challenges and emerging directions in the analysis and optimization of advanced thermal systems.

We look forward to receiving your valuable contributions and to advancing research in this field.

Dr. Roberta Caruana
Dr. Xiaoyun Xie
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Modelling is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1200 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • computational fluid dynamics
  • engineering applications
  • modelling
  • optimization
  • simulation
  • thermal systems

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Published Papers

This special issue is now open for submission.
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