Search for Articles:
Title / Keyword
Author / Affiliation / Email
Journal
Article Type
 
 
Advanced Search
 
Section
Special Issue
Volume
Issue
Number
Page
 
4.7
3.4
Journals
Micromachines
Special Issues
Heat Management in Microdevices
share announcement

Heat Management in Microdevices

A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: closed (31 July 2021) | Viewed by 1972

Special Issue Editor

Dr. Xian Zhang

E-Mail Website
Guest Editor
Mechanical Engineering, Stevens Institute of Technology, Castle Point on Hudson, Hoboken, NJ 07030, USA
Interests: low dimensional materials; nanomanufacturing; thermal science; sensing

Special Issue Information

Dear Colleagues,

Thermal management in micro/nanosystems is hailed as a revolutionary field for practical applications. According to Moore’s law, the size of electronic devices and circuitry is decreasing, and their number keeps increasing. The resultant change on thermal management will challenge device performance, including measurement reliability and durability of material component stability, electric transports, and data communication. Discovering and understanding thermal properties in micro- and nanoscale devices and realizing an efficient performance of micro/nanosystems is fundamentally important to harnessing thermal management in the field of micro/nanoelectronics. This Special Issue will cover fundamental thermal transport theory and modeling of micro/nanosystems and elucidate how thermal management can improve device performance. Interdisciplinary topics in thermal science at the interaction of electrical engineering, mechanical engineering, materials science, and physics will be welcomed to accelerate the understanding of thermal management in micro/nanosystems.

Dr. Xian Zhang
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • micro/nanosystems
  • thermal management
  • thermal transport
  • thermoelectric
  • electronic devices

Published Papers (1 paper)

Order results
Result details
Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:

Research

10 pages, 1786 KiB  
Article
Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices
by Yanan Yu, Yafei Yin, Yuhang Li, Min Li and Jizhou Song
Micromachines 2021, 12(10), 1165; https://doi.org/10.3390/mi12101165 - 28 Sep 2021
Cited by 4 | Viewed by 1550
Abstract
Heat generation is a major issue in all electronics, as heat reduces product life, reliability, and performance, especially in flexible electronics with low thermal-conductivity polymeric substrates. In this sense, the active heat dissipation design with flow channels holds great promise. Here, a theoretical [...] Read more.
Heat generation is a major issue in all electronics, as heat reduces product life, reliability, and performance, especially in flexible electronics with low thermal-conductivity polymeric substrates. In this sense, the active heat dissipation design with flow channels holds great promise. Here, a theoretical model, validated by finite element analysis and experiments, based on the method of the separation of variables, is developed to study the thermal behavior of the active heat dissipation design with an embedded flow channel. The influences of temperature and flow velocity of the fluid on heat dissipation performance were systematically investigated. The influence of channel spacing on heat dissipation performance was also studied by finite element analysis. The study shows that performance can be improved by decreasing the fluid temperature or increasing the flow velocity and channel density. These results can help guide the design of active heat dissipation with embedded flow channels to reduce adverse effects due to excessive heating, thus enhancing the performance and longevity of electronic products. Full article
(This article belongs to the Special Issue Heat Management in Microdevices)
►▼ Show Figures

Figure 1

Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:
 
Displaying articles 1-1
Back to TopTop