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Selected Papers from the ICMR 2019

Special Issue Information

Dear Colleagues,

Reliability is an important consideration across various industries, including electronics, automotive, heavy-chemical industries, and power plants. The international competitiveness of those industries in a globalized economy is closely tied to the high reliability of their technologies, products, and materials.

In this context, this special issue aims to showcase the latest reliability, and Prognostics and Health Management (PHM) research trends, including their applications, advanced technologies and processes for reliability assessment, advanced theoretical and experimental reliability analysis, and other related topics.

This special issue welcomes full article submissions from presenters, and speakers at the 5th International Conference on Materials and Reliability (ICMR 2019), held November 27-29, 2019 in Jeju, Republic of Korea.

Prof. Sang-Jae Kim
Dr. Hyunseok Oh
Dr. Sunghan Kim
Dr. Hoyong Lee
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Reliability
  • Prognostics and Health Management
  • Advanced Materials
  • Material Characterization
  • Risk Assessment
  • Big Data Analytics
  • Smart Manufacturing
  • Accelerated Life Testing

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Published Papers

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Appl. Sci. - ISSN 2076-3417