Special Issue "Flexible and Stretchable Microwave Devices: Design, Fabrication and Applications"
Deadline for manuscript submissions: 15 August 2020.
Interests: antennas; applied electromagnetics; microwave systems; 3D printing
Interests: stretchable electronics; transient sensors; mechanics of materials; advanced manufacturing
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Special Issue in Sensors: Materials, Designs, and Manufacturing Innovations for Bio-Integrated Sensors and Systems
The growing interest in wearable wireless electronics and other unconventional wireless applications has created new opportunities for microwave devices that can withstand shape deformations and mechanical strain without impacting performance. A number of challenges remain in realizing these systems. To meet both the electrical and mechanical requirements of these applications, low-loss dielectrics, including textiles and elastomers, are combined with a variety of flexible conductors, including liquid metals; conductive composites; and thin, metallic ribbons. Devices must incorporate anticipated shape deformation into their design in order to maintain their properties during operation. In addition, high-frequency interconnects between conventional rigid electronics and soft electronics remain challenging. At the same time, shape deformation can also enable new functionality. For example, antennas can reconfigure their properties by altering their dimensions and shape. Other microwave devices such as frequency-selective surfaces can deliver new capability via intentional shape deformation, e.g., folding and stretching structures using origami principles or other means. In light of these recent developments and the remaining challenges, this Special Issue seeks research papers, communications, and review articles that describe advances in flexible and stretchable microwave materials and devices as well as applications of these technologies.
Prof. Jacob J. Adams
Prof. Huanyu (Larry) Cheng
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Flexible electronics
- Liquid metal
- Wearable electronics