Special Issue "Flexible Electronics: Fabrication and Ubiquitous Integration, Volume II"

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A:Physics".

Deadline for manuscript submissions: 31 December 2019.

Special Issue Editor

Dr. Ramses V. Martinez
E-Mail Website
Guest Editor
School of Industrial Engineering, Weldon School of Biomedical Engineering, Purdue University, Grissom Hall (GRIS) Rm.284, 315 N. Grant Street, West Lafayette, IN 47907-2023, USA
Tel. +1-765-496-0399
Interests: wearable devices; self-powered flexible sensors; soft robotics
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Special Issue Information

Dear Colleagues,

The development of flexible electronic solutions as wearable and conformable sensors, displays, and powering devices is making a huge impact on the integration of electronic and optical systems in our daily lives. Flexible electronic platforms benefit from their bendability, low profile, and light weight to provide highly adaptable industrial and medical devices and enable the integration of sensitive electronic skins on large objects, robots, or machines with complex 3D shapes. To realize their full potential, however, it is necessary to develop new manufacturing, assembly, and packaging methods to create multifunctional flexible devices at a reduced cost and with an increased resistance to mechanical fatigue. Accordingly, this Special Issue seeks to showcase short communications, research papers, and review articles that focus on novel methodological development for the fabrication and integration of organic and inorganic flexible electronics in healthcare, environmental monitoring, displays and human–machine interactivity, robotics, communication and wireless networks, and energy conversion, management, and storage. Novel, large-area processing methods, such as ink-jet processing, solution deposition, spray pyrolysis, or roll-to-roll processing, and cutting-edge work on flexible designs and form factors are also of interest.

Dr. Ramses V. Martinez
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Flexible electronics
  • Stretchable electronics
  • Printable electronics
  • Epidermal electronics
  • Robotic skin
  • Conformable sensors
  • Low-cost flexible devices
  • Flexible displays
  • Flexible energy storage
  • Flexible energy conversion
  • Flexible electronic textiles
  • Wearable flexible devices

Published Papers (2 papers)

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Research

Open AccessArticle
Evolutionary Computation for Parameter Extraction of Organic Thin-Film Transistors Using Newly Synthesized Liquid Crystalline Nickel Phthalocyanine
Micromachines 2019, 10(10), 683; https://doi.org/10.3390/mi10100683 - 10 Oct 2019
Abstract
In this work, the topic of the detrimental contact effects in organic thin-film transistors (OTFTs) is revisited. In this case, contact effects are considered as a tool to enhance the characterization procedures of OTFTs, achieving more accurate values for the fundamental parameters of [...] Read more.
In this work, the topic of the detrimental contact effects in organic thin-film transistors (OTFTs) is revisited. In this case, contact effects are considered as a tool to enhance the characterization procedures of OTFTs, achieving more accurate values for the fundamental parameters of the transistor threshold voltage, carrier mobility and on-off current ratio. The contact region is also seen as a fundamental part of the device which is sensitive to physical, chemical and fabrication variables. A compact model for OTFTs, which includes the effects of the contacts, and a recent proposal of an associated evolutionary parameter extraction procedure are reviewed. Both the model and the procedure are used to assess the effect of the annealing temperature on a nickel-1,4,8,11,15,18,22,25-octakis(hexyl)phthalocyanine (NiPc6)-based OTFT. A review of the importance of phthalocyanines in organic electronics is also provided. The characterization of the contact region in NiPc6 OTFTs complements the results extracted from other physical–chemical techniques such as differential scanning calorimetry or atomic force microscopy, in which the transition from crystal to columnar mesophase imposes a limit for the optimum performance of the annealed OTFTs. Full article
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Open AccessArticle
High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer
Micromachines 2019, 10(3), 160; https://doi.org/10.3390/mi10030160 - 26 Feb 2019
Abstract
Modern design-conscious products have raised the development of advanced electronic fabricating technologies. These widely used industrial technologies show high compatibility for inorganic materials and capacity for mass production. However, the morphology accuracy is hard to ensure and cracks happen easily, which could cause [...] Read more.
Modern design-conscious products have raised the development of advanced electronic fabricating technologies. These widely used industrial technologies show high compatibility for inorganic materials and capacity for mass production. However, the morphology accuracy is hard to ensure and cracks happen easily, which could cause the degradation of device performance and life span. In order to make high precision 3D conformable electronics, a thermal phase-changing adhesion interlayer and modified fabricating processes are used in self-developed equipment. The working principles and influencing factors such as heating time and geometry parameters are studied quantitatively. The accuracy of fabricated patterns is enhanced by this new technology and serpentine designed structures. The delamination or detachment are significantly alleviated. Due to the operation convenience and compatibility with existing materials, the presented fabrication method has great potential for mass production of 3D curved conformable electronics. Full article
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