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Special Issue "Flexible Electronics: Fabrication and Ubiquitous Integration, Volume II"
Deadline for manuscript submissions: 31 December 2019.
School of Industrial Engineering, Weldon School of Biomedical Engineering, Purdue University, Grissom Hall (GRIS) Rm.284, 315 N. Grant Street, West Lafayette, IN 47907-2023, USA
Interests: wearable devices; self-powered flexible sensors; soft robotics
Special Issues and Collections in MDPI journals
The development of flexible electronic solutions as wearable and conformable sensors, displays, and powering devices is making a huge impact on the integration of electronic and optical systems in our daily lives. Flexible electronic platforms benefit from their bendability, low profile, and light weight to provide highly adaptable industrial and medical devices and enable the integration of sensitive electronic skins on large objects, robots, or machines with complex 3D shapes. To realize their full potential, however, it is necessary to develop new manufacturing, assembly, and packaging methods to create multifunctional flexible devices at a reduced cost and with an increased resistance to mechanical fatigue. Accordingly, this Special Issue seeks to showcase short communications, research papers, and review articles that focus on novel methodological development for the fabrication and integration of organic and inorganic flexible electronics in healthcare, environmental monitoring, displays and human–machine interactivity, robotics, communication and wireless networks, and energy conversion, management, and storage. Novel, large-area processing methods, such as ink-jet processing, solution deposition, spray pyrolysis, or roll-to-roll processing, and cutting-edge work on flexible designs and form factors are also of interest.
Dr. Ramses V. Martinez
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Flexible electronics
- Stretchable electronics
- Printable electronics
- Epidermal electronics
- Robotic skin
- Conformable sensors
- Low-cost flexible devices
- Flexible displays
- Flexible energy storage
- Flexible energy conversion
- Flexible electronic textiles
- Wearable flexible devices