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Review

Recent Advances on Thermal Management of Flexible Inorganic Electronics

1
Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, China
2
State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, China
3
Institute of Structure and Environment Engineering, Beijing 100076, China
4
Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
*
Author to whom correspondence should be addressed.
Micromachines 2020, 11(4), 390; https://doi.org/10.3390/mi11040390
Received: 28 February 2020 / Revised: 27 March 2020 / Accepted: 5 April 2020 / Published: 9 April 2020
Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissipation capacity of the soft polymer substrate of FIEDs demands proper thermal management to reduce the undesired thermal influences. The biointegrated applications of FIEDs pose even more stringent requirements on thermal management due to the sensitive nature of biological tissues to temperature. In this review, we take microscale inorganic light-emitting diodes (μ-ILEDs) as an example of functional components to summarize the recent advances on thermal management of FIEDs including thermal analysis, thermo-mechanical analysis and thermal designs of FIEDs with and without biological tissues. These results are very helpful to understand the underlying heat transfer mechanism and provide design guidelines to optimize FIEDs in practical applications. View Full-Text
Keywords: flexible inorganic electronics; thermal management; epidermis; microscale inorganic light-emitting diodes flexible inorganic electronics; thermal management; epidermis; microscale inorganic light-emitting diodes
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MDPI and ACS Style

Li, Y.; Chen, J.; Zhao, S.; Song, J. Recent Advances on Thermal Management of Flexible Inorganic Electronics. Micromachines 2020, 11, 390. https://doi.org/10.3390/mi11040390

AMA Style

Li Y, Chen J, Zhao S, Song J. Recent Advances on Thermal Management of Flexible Inorganic Electronics. Micromachines. 2020; 11(4):390. https://doi.org/10.3390/mi11040390

Chicago/Turabian Style

Li, Yuhang, Jiayun Chen, Shuang Zhao, and Jizhou Song. 2020. "Recent Advances on Thermal Management of Flexible Inorganic Electronics" Micromachines 11, no. 4: 390. https://doi.org/10.3390/mi11040390

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