MEMS Packaging Technologies and 3D Integration, 3rd Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D:Materials and Processing".

Deadline for manuscript submissions: 31 December 2024 | Viewed by 2745

Special Issue Editor


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Guest Editor
Center for Nanoscience and Nanotechnology (C2N), University-Paris-Saclay, F-91405 Orsay, France
Interests: packaging; MEMS; integration; bonding; polymer; adhesion
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Special Issue Information

Dear Colleagues,

MEMS packaging is essential technique to the successful commercialization of MEMS products, as MEMS has moving parts and an application-specific nature. The classic approach to MEMS packaging involves the bonding of silicon or glass cap wafers to MEMS wafers. Therefore, it is typically implemented under high-pressure and high-temperature conditions. Advanced approaches use the thin-film deposition technique, and then the cavity for MEMS is realized via sacrificial etch through access holes at the thin-film cap. The packaging cap transfer technique is a compromise between the two approaches, making it possible to bond and transfer the thin packaging cap to the released MEMS device. MEMS devices and IC are being integrated into 3D fashion to achieve better performance, but the implantable device requires special packaging techniques. Thus, this Special Issue seeks research papers, communications, and review articles that focus on MEMS packaging technologies and related integration methods.

Dr. Seonho Seok
Guest Editor

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Keywords

  • MEMS
  • packaging
  • bonding
  • integration
  • vacuum
  • implantable
  • biocompatibility
  • reliability

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Published Papers (1 paper)

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Research

17 pages, 12847 KiB  
Article
Influence of Pd-Layer Thickness on Bonding Reliability of Pd-Coated Cu Wire
by Junling Fan, Donglin Yuan, Juan Du, Tao Hou, Furong Wang, Jun Cao, Xuemei Yang and Yuemin Zhang
Micromachines 2024, 15(7), 931; https://doi.org/10.3390/mi15070931 - 22 Jul 2024
Cited by 1 | Viewed by 836
Abstract
In this paper, three Pd-coated Cu (PCC) wires with different Pd-layer thicknesses were used to make bonding samples, and the influence of Pd-layer thickness on the reliability of bonded points before and after a high-temperature storage test was studied. The results show that [...] Read more.
In this paper, three Pd-coated Cu (PCC) wires with different Pd-layer thicknesses were used to make bonding samples, and the influence of Pd-layer thickness on the reliability of bonded points before and after a high-temperature storage test was studied. The results show that smaller bonding pressure and ultrasonic power lead to insufficient plastic deformation of the ball-bonded point, which also leads to small contact area with the pad and low bonding strength. Excessive bonding pressure and ultrasonic power will lead to ‘scratch’ on the surface of the pad and large-scale Ag spatter. The wedge-bonded point has a narrowed width when the bonding pressure and ultrasonic power are too small, and the tail edge will be cocked, resulting in false bonding and low strength. When the bonding pressure or ultrasonic power is too large, it will cause stress concentration, and the pad will appear as an ‘internal injury’, which will improve the failure probability; a high-temperature environment can make Cu-Ag intermetallic compounds (IMCs) grow and improve the bonding strength. With the extension of high-temperature storage time, the shear force of Pd100 gradually reaches the peak and then decreases, due to Kirkendall pores caused by excessive growth of IMCs, while the shear force of Pd120 continued to increase due to the slow growth rate of IMCs. In the high-temperature storage test, the thicker the Pd layer of the bonding wire, the higher the bonding strength; in the cold/hot cycle test, the sample with the largest Pd-layer thickness has the lowest failure rate. The thicker the Pd layer, the stronger its ability to resist changes in the external environment, and the higher its stability and reliability. Full article
(This article belongs to the Special Issue MEMS Packaging Technologies and 3D Integration, 3rd Edition)
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