Special Issue "2D Materials based Flexible Sensors and Electronics"

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D:Materials and Processing".

Deadline for manuscript submissions: closed (28 February 2019)

Special Issue Editors

Guest Editor
Prof. Mark Ming-Cheng Cheng

Department of Electrical and Computer Engineering, Wayne State University, Detroit, MI 48202, USA
Website | E-Mail
Interests: 2D materials; biomedical devices; neural probes; sensors; nanotechnology
Guest Editor
Prof. Cunjiang Yu

Department of Mechanical Engineering, University of Houston, Houston, TX 77204, USA
Website | E-Mail
Interests: flexible/stretchable electronics; bio-sensors and electronics; micro/nano fabrication; MEMS; nano materials and devices

Special Issue Information

Dear Colleagues,

Two-dimensional materials, including graphene, transition metal dichalcogenides, and xenes, have attracted a great deal of interest from academics and industries. While 2D materials started with a humble and simple Scotch-tape method, high-quality wafer-scale synthesis have been demonstrated. These 2D materials have exotic material properties, including transparency in the visible light range, mechanical flexibility, piezoelectricity, high electron mobility and excellent electrochemical properties. Metal dischalocgenides have bandgaps that enable many applications, including digital electronics, photoelectronics and sensing of chemical/biological samples. In particular, the unique geometries of 2D materials, together with their advantages in device performances, promise their application in flexible electronics. In this Special Issue, we would like to invite experts in the field to contribute their work. The topics include, but are not limited to:

  1. Large-scale Synthesis of 2D Materials
  2. Mechancial/chemical/biochemical/magnetics/Optical Sensing using 2D materials
  3. Advanced Electronics Architectures Using 2D Materials.
  4. Other emerging applications of 2D materials.

Prof. Mark Ming-Cheng Cheng
Prof. Cunjiang Yu
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • 2D materials
  • graphene
  • metal dischalocgenides
  • flexible sensors and electronics

Published Papers (1 paper)

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Research

Open AccessCommunication
Investigating the Potential of Commercial-Grade Carbon Black-Filled TPU for the 3D Printing of Compressive Sensors
Micromachines 2019, 10(1), 46; https://doi.org/10.3390/mi10010046
Received: 15 November 2018 / Revised: 30 December 2018 / Accepted: 1 January 2019 / Published: 10 January 2019
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Abstract
The present research aims to exploit commercially available materials and machines to fabricate multilayer, topologically designed transducers, which can be embedded into mechanical devices, such as soft or rigid grippers. Preliminary tests on the possibility of fabricating 3D-printed transducers using a commercial conductive [...] Read more.
The present research aims to exploit commercially available materials and machines to fabricate multilayer, topologically designed transducers, which can be embedded into mechanical devices, such as soft or rigid grippers. Preliminary tests on the possibility of fabricating 3D-printed transducers using a commercial conductive elastomeric filament, carbon black-filled thermoplastic polyurethane, are presented. The commercial carbon-filled thermoplastic polyurethane (TPU), analyzed in the present paper, has proven to be a candidate material for the production of 3D printed displacement sensors. Some limitations in fabricating the transducers from a 2.85 mm filament were found, and comparisons with 1.75 mm filaments should be conducted. Moreover, further research on the low repeatability at low displacements and the higher performance of the hollow structure, in terms of repeatability, must be carried out. To propose an approach that can very easily be reproduced, only commercial filaments are used. Full article
(This article belongs to the Special Issue 2D Materials based Flexible Sensors and Electronics)
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