Selected Papers from the 20th EuroSimE Conference

A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: closed (1 October 2019) | Viewed by 369

Special Issue Editors


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Guest Editor
Electronic Components, Technology and Materials (ECTM) Group, Department of Microelectronics, Delft University of Technology, Mekelweg 4, 2628 CD Delft, The Netherlands
Interests: reliability; systems; integration; virtual prototyping; statistics; health monitoring
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
Computational Mechanics and Reliability Group, University of Greenwich, Old Royal Naval College, Park Row, London SE10 9LS, UK
Interests: computational mechanics, multiphysics modelling, engineering reliability

Special Issue Information

Dear Colleagues,

On behalf of the Editorial Board, we are pleased to propose a selection of papers presented at the 20th IEEE International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems (EurosimE 2019) held in the city of Hannover, Germany, on 24–27 March, 2019 (www.eurosime.org). EuroSimE was created as the only annual international conference with a focus on thermal, mechanical and multiphysical simulations and experiments for microelectronics and microsystems. The first conference was initiated in 2000 by the COMPETE network, with sponsorship from the European Commission, to meet research and development needs in the fields of microelectronics and microsystems. Since then, EuroSimE has garnered worldwide attention with participants from more than 30 countries, spanning all continents, and has become a fully sponsored IEEE CPMT technical event. The EuroSimE conference has earned a reputation for high scientific and technical quality. We hope that this Special Issue will be helpful to your work. We also welcome your feedback and suggestions for improving our work, with the aim of providing you with valuable references in the future. We would also like to sincerely thank the journal Micromachines for its editorial support and constant assistance throughout the preparation of this issue.

Prof. Willem Dirk van Driel
Prof. Christopher Bailey
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • nano-electronic mechanical devices
  • microfluidics
  • multiphysics simulation
  • fluid structure interactions
  • integrated process modelling
  • additive manufacturing, MEMS sensors and actuators

Published Papers

There is no accepted submissions to this special issue at this moment.
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