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Micromachines
Special Issues
Current Trends in Miniature Devices: Design, Fabrication, and Applications
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Current Trends in Miniature Devices: Design, Fabrication, and Applications

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".

Deadline for manuscript submissions: 30 August 2025 | Viewed by 2739

Special Issue Editors

Dr. Jana Abou-Ziki

E-Mail Website
Guest Editor
Department of Mechanical and Manufacturing Engineering, Ontario Tech University, Oshawa, ON L1G 0C5, Canada
Interests: micro-manufacturing; hybrid additive-subtractive manufacturing; surface functionalization; electroforming of miniature parts
Special Issues, Collections and Topics in MDPI journals
Dr. Amirkianoosh Kiani

E-Mail Website1 Website2
Guest Editor
Department of Mechanical and Manufacturing Engineering, Ontario Tech University, Oshawa, ON L1G 0C5, Canada
Interests: advanced fabrication techniques; optoelectronic miniature devices; advanced sensing materials for miniature sensors
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Currently, with growing competitiveness in today’s fast-paced market, and ever-increasing customer expectations for higher-quality products, the need for technologies that can rapidly manufacture these components at an affordable price is increasing. Such technologies must be flexible to adapt to rapidly shifting market needs while possessing a lower environmental footprint. Hence, the technology’s capability to handle multiple materials and fabricate multi-material devices is significant, especially when it comes to fabricating compact smart devices, which are in high demand nowadays. In almost all industries, smart sensors, supercapacitor, actuators, and microchips are required, and such devices are expected to operate with higher functionality while being robust.

This Special Issue aims to cover topics related to innovations in the current trends in miniatured devices: design, fabrication, and applications for multiple applications ranging from medical to optical to electronics/opto-electronics to positioning ones. The design and fabrication of microfluidic devices, including paper-based devices and wearable devices, as well as sensors, printed circuit boards, and positioning systems, are topics of interest. Fabrication involves achieving the required geometry and functionality. Therefore, surface functionalization and the development of manufacturing technologies and design methods that enable the rapid and efficient fabrication of such devices or parts are also of interest to this Issue. Therefore, the three major topics that this Special Issue covers are:

  • Design and fabrication of multi-material systems for various applications;
  • Functionalization of the surface properties of microdevices for enhanced performance;
  • Developments in manufacturing methods for fabricating special-purpose miniature systems;
  • Innovations in technology-related design methods for more efficient, faster, and/or less costly fabrication.

Dr. Jana Abou-Ziki
Dr. Amirkianoosh Kiani
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • advanced miniature design/fabrication/applications
  • miniature devices
  • paper-based devices
  • wearable devices
  • multi-material fabrication
  • surface processing
  • surface functionalization

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Further information on MDPI's Special Issue policies can be found here.

Published Papers (2 papers)

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Research

13 pages, 24784 KiB  
Article
Long-Distance Passive Sensing Tag Design Based on Multi-Source Energy Harvesting and Reflection Amplification
by Gang Li, Chong Pan, Bo Wu, Zhiliang Xu, Shihua Li, Yehua Zhang, Yongjun Yang, Zhuohang Zou, Chang Shi and Muze Wang
Micromachines 2025, 16(1), 18; https://doi.org/10.3390/mi16010018 - 26 Dec 2024
Viewed by 831
Abstract
Wireless sensor networks often rely on battery power, which incurs high costs, considerable volume, and a limited lifespan. Additionally, the communication range of existing passive sensor tags remains short, which challenges their suitability for evolving Internet of Things (IoT) applications. This paper, therefore, [...] Read more.
Wireless sensor networks often rely on battery power, which incurs high costs, considerable volume, and a limited lifespan. Additionally, the communication range of existing passive sensor tags remains short, which challenges their suitability for evolving Internet of Things (IoT) applications. This paper, therefore, presents a long-distance passive RFID sensing tag that integrates multi-source energy harvesting and reflection amplification. Multi-source energy harvesting enhances tag receiving sensitivity and extends the system’s downlink communication distance, while reflection amplification increases tag reflection power and improves the uplink communication distance, thereby significantly expanding the overall communication range. The test results show that the tag achieves a receiving sensitivity of −45 dBm, a reflection gain of 44 dB, and a communication distance of up to 96 m. Full article
(This article belongs to the Special Issue Current Trends in Miniature Devices: Design, Fabrication, and Applications)
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22 pages, 14417 KiB  
Article
Electroforming of Personalized Multi-Level and Free-Form Metal Parts Utilizing Fused Deposition Modeling-Manufactured Molds
by Hazem Hamed, Sayedmohammadali Aghili, Rolf Wüthrich and Jana D. Abou-Ziki
Micromachines 2024, 15(6), 734; https://doi.org/10.3390/mi15060734 - 31 May 2024
Cited by 1 | Viewed by 1373
Abstract
Adapting to the growing demand for personalized, small-batch manufacturing, this study explores the development of additively manufactured molds for electroforming personalized metal parts. The approach integrates novel multi-level mold design and fabrication techniques, along with the experimental procedures for the electroforming process. This [...] Read more.
Adapting to the growing demand for personalized, small-batch manufacturing, this study explores the development of additively manufactured molds for electroforming personalized metal parts. The approach integrates novel multi-level mold design and fabrication techniques, along with the experimental procedures for the electroforming process. This work outlines design considerations and guidelines for effective electroforming in additively manufactured molds, successfully demonstrating the production of composite metal components with multi-level and free-form geometries. By emphasizing cost efficiency and part quality, particularly for limited-thickness metal components, the developed technique offers distinct advantages over existing metal additive manufacturing methods. This approach establishes itself as a flexible and durable method for metal additive manufacturing, expanding the scope of electroforming beyond traditional constraints such as thin-walled hollow structures, 2D components, and nanoscale applications. Full article
(This article belongs to the Special Issue Current Trends in Miniature Devices: Design, Fabrication, and Applications)
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