Research of Crystallographic Texture Gradients Related to Manufacturing Processes and Welding

A special issue of Metals (ISSN 2075-4701).

Deadline for manuscript submissions: closed (2 September 2020) | Viewed by 349

Special Issue Editor


E-Mail Website
Guest Editor
Department TEXMAT, Clausthal University of Technology and Helmholtz-Zentrum Geesthacht (HZG), Max-Planck-Str, D-21502 Geesthacht, Germany
Interests: materials characterization by X-rays; neutrons, synchrotron, and EBSD; instrumentation; texture, phase, and stress analysis; Mg, Al, and Ti alloys; industrial application
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Many manufacturing and welding processes result in gradients of the crystallographic texture. Their importance is based on the degree of anisotropic materials properties due to crystallographic texture. Typical examples are profile extrusion, tube drawing, non-uniform deep drawing, as well as similar and dissimilar joining. These texture gradients can be very important, on the one hand, to improve the properties (surface treatment) and, on the other hand, to limit their applications (limited lifetime, reduced stability, and reduced properties), as the function of the length scale of the gradient of different methods can be used to investigate the crystallographic texture gradient. The highest local resolution is given for EBSD, but intense sample preparation is needed. The lowest local resolution is for neutron diffraction with a minimum of sample preparation. In between is the high brilliant synchrotron beam with hard X-rays and all kinds of laboratory X-rays down to µ-focus diffraction.

We ask for all kinds of texture gradients without prioritizing the method.

Keywords

  • Gradient of crystallographic textures
  • Diffraction methods by X-rays
  • Synchrotron
  • Neutron
  • EBSD
  • Non-uniform materials flow during manufacturing
  • Welding

Published Papers

There is no accepted submissions to this special issue at this moment.
Back to TopTop