Special Issue "Recent Advances in Soft Electronics and Ionics"
A special issue of Materials (ISSN 1996-1944).
Deadline for manuscript submissions: closed (15 March 2020).
Interests: mechanics and advanced manufacturing of soft, organic, and transient electronics and ionics
Special Issues and Collections in MDPI journals
As electronic devices are getting more and more integrated into our everyday activities, the need to minimize mechanical mismatch between electronic devices (rigid by nature) and biological systems (soft by nature) is becoming more eminent. There is a broad range of applications for soft, flexible, and stretchable electronic devices in a variety of fields of research, including biomedical, sensing, actuation, energy storage, energy harvesting, hardware security, military, athletics, and rehabilitation. The deformability of such electronic devices is, however, counterintuitive to the physical and dimensional stability that is required for the stable operation of electronic devices.
Recent innovative approaches and game-changing discoveries, including high-resolution and high-fidelity print-base additive manufacturing of electronics, advances in ionic devices and ion-to-electron transducers, and design of novel all-organic conductive inks, have paved the way for the next generation of electronic and ionic devices capable of maintaining their electrical/ionic attributes while under physical stress and deformation. While such innovations and discoveries are at their early stage, they have paramount potentials to change how we design, manufacture, and operate electronic/ionic devices in the near future.
The ultimate goal of this Special Issue is to gather and disseminate the most innovative, impactful, and recent advances and discoveries in the field of soft electronic and ionic devices.
This Special Issue welcomes communications, full papers, and review papers reporting new discoveries and advances in the following areas of research:
- Mechanics of printed soft electronic/ionic devices;
- Advanced additive manufacturing (3D printing) of soft electronic/ionic devices;
- Mechanics and advanced manufacturing of transient electronic/ionic devices and materials;
- Mechanics and advanced manufacturing of all-organic electronic/ionic devices;
- Advancements in integration of metal organic frameworks (MOFs) and covalent organic frameworks (COFs) in soft electronic/ionic devices;
- Innovative and novel applications of soft electronic/ionic devices;
- Innovative approaches to design and synthesis of new organic conjugated inks for printable soft electronic/ionic devices;
- Soft and flexible ion-to-electron transducers.
Prof. Reza Montazami
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Soft electronics
- Printable electronics
- Transient electronics
- Ionic devices
- Soft MOFs and COFs