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Advanced Materials for Power Electronics

Special Issue Information

Dear Colleagues,

Materials are fundamental to the field of power electronics, which relies on semiconductor devices (diodes and transistors) and other electrical components (resistors, capacitors, inductors, and transformers) to control the flow of electrical power. Power electronics researchers are constantly driven to improve the efficiency, power density, and reliability of power electronics converters through incremental advances in device, component, and converter integration technologies. However, breakthrough technologies in the field are enabled by innovative developments in materials. For example, it is the advancement made in the crystal growth of gallium nitride (GaN) on silicon that brought a new excitement in the field and has led to a large number of research activities on GaN-based power electronics converters.

The aim of this Special Issue on “Advanced Materials for Power Electronics” is to capture recent developments in all types of materials for advancing power electronics. These developments include wide bandgap semiconductors for devices, dielectrics for capacitors, soft magnetic materials for inductors and transformers, interconnect and encapsulation materials for packaging, thermal interface materials for cooling, and feedstock materials of additive manufacturing for power electronics packaging and integration. Manuscripts in the form of full research papers, communications, and review articles are encouraged.

This issue will provide an in-depth review of the current work in advanced materials for power electronics, and also point to emerging and future research directions. I look forward to your contribution in this Special Issue.

Prof. Dr. Guoquan Lu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • wide band-gap semiconductor materials for power devices
  • dielectrics for power electronics capacitors
  • soft magnetic materials for power inductors and transformers
  • die-attach, interconnect, and encapsulation materials for power packaging
  • thermal interface materials for cooling
  • feedstock materials of additive manufacturing for heterogeneous integration

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Materials - ISSN 1996-1944Creative Common CC BY license