Novel Materials and Processes for Electronic Packaging

Dear Colleagues,

Driven by new applications ranging from super-computing and fifth/sixth-generation (5G/6G) communications to electric vehicles (EVs) and green energy, advanced high-density electronic packaging technologies, as well as high-power electronic interconnection are in great demand in the electronic industry. Meanwhile, sustainable materials and manufacturing technologies are also needed to meet the low-emission requirements for carbon neutrality. To achieve high-density and high-reliable electronic devices with low energy consumption, innovative materials and processes for electronic packaging play key roles. For high-density packaging, three-dimensional (3D) integration is an emerging technology, while for sustainable processes, low-temperature processes are desired. The 3D structures involve through-silicon-via (TSV), advanced ceramic substrates, and metal-to-metal or metal-to-ceramics bonding, which require various kinds of electronic interconnection technologies, e.g., solder bumping, transient-liquid-phase (TLP) bonding, thermal compression bonding, adhesive bonding, and active metal brazing (ABM). The reliability of heterogeneous interfaces such as warpage and the formation of brittle intermetallic compounds (IMCs) is the major concern for evaluating the materials and processes. 

This Special Issue will cover current challenges, progresses, and outlooks of novel materials and processes for electronic packaging based on advanced simulation and characterizations. Research papers and critical reviews on these fields are both highly welcome.

Prof. Dr. Shih-Kang Lin
Guest Editor

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