Special Issue "Interfacial and Transport Phenomena between Liquid Metal and Solid Structural Materials"

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Materials Physics".

Deadline for manuscript submissions: 30 June 2021.

Special Issue Editors

Prof. Dr. Donatella Giuranno
E-Mail Website
Guest Editor
National Research Council of Italy-Institute of Condensed Matter Chemistry and Technologies for Energy
Interests: metals and alloys; metal–metal and metal–ceramic interactions; advanced materials and composites
Special Issues and Collections in MDPI journals
Dr. Wojciech Polkowski
E-Mail Website
Guest Editor
Łukasiewicz Research Network - Krakow Institute of Technology, Poland
Interests: severe plastic deformation; plasticity; materials strengthening; solid/liquid interfacial phenomena; high temperature materials; intermetallics
Special Issues and Collections in MDPI journals

Special Issue Information

Dear Colleagues,

Research activities in materials science typically range from basic and curiosity-motivated research to applications-oriented and the well known Materials Science paradigm is usually followed: Processing → Microstructure → Properties → Performance.

Nowadays, thanks to the use of computational models, an inversed trend is observing and the Material Designs approach is successfully taking off. Materials design basically focuses on the design and production of new materials exhibiting novel tailored-structures and properties meeting the requirements of specific applications. In order to succeed, the links with basic research cannot be disregarded. In particular, taking into account the influence of the process/working conditions on the final developed microstructures, investigations carried out by following the systematic approach of basic research still remain crucial. Such comprehensive and multidisciplinary investigations enable to optimize the manufacturing of advanced materials via vapour, solid and liquid-assisted processes such as PVD and CVD, solid state reactions, casting and solidification, metal infiltration, etc. In addition, post-production phenomena occurring within thermal treatments, or exposing in service the material to high temperatures and aggressive environments, can be predicted. In particular, the interaction phenomena occurring between dissimilar materials such as metals and ceramics are of particular relevance. 

The aim of this Special Issue is to stimulate worldwide researchers to share their most interesting experiences and know-how on the interaction observed when liquid metals are in contact with solid materials. For this purpose, original research articles, review articles, and significant preliminary communications are invited, with particular interest in articles describing current research trends and future perspectives in the manufacture of tailored advanced materials for highly demanding applications.

Potential topics include but are not limited to:

-Surfaces and Interfaces at high temperatures: theory versus experiment

-Surface and bulk properties of liquid metals and alloys.

-Oxidation of liquid metal surfaces

-Coatings

-Thermodynamic studies

-Wetting at high temperatures

-Soldering, Brazing and Joining processes

-Casting and solidification processes

-Reactive infiltration

-Corrosion of structural materials by liquid metals 

-Liquid-assisted processes

-Liquid and solid-state reactivity

-Improvements in the experimental investigation of liquid metal phases at high temperatures.

-Advanced composites materials

-Light-weight materials

Dr. Donatella Giuranno
Dr. Wojciech Polkowski
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Liquid metal/ceramic interfaces at high temperatures
  • Interfacial phenomena
  • Reactivity
  • Tailored structural materials
  • Advanced composites
  • Modelling
  • Transport phenomena

Published Papers (2 papers)

Order results
Result details
Select all
Export citation of selected articles as:

Research

Jump to: Review

Open AccessArticle
Reactive Infiltration and Microstructural Characteristics of Sn-V Active Solder Alloys on Porous Graphite
Materials 2020, 13(7), 1532; https://doi.org/10.3390/ma13071532 - 27 Mar 2020
Cited by 2 | Viewed by 818
Abstract
In this work, the reactive wetting and infiltration behaviors of a newly designed Sn-V binary alloy were comprehensively explored on porous graphite for the first time. It was discovered that 0.5 wt.% addition of V can obviously improve the wettability of liquid Sn [...] Read more.
In this work, the reactive wetting and infiltration behaviors of a newly designed Sn-V binary alloy were comprehensively explored on porous graphite for the first time. It was discovered that 0.5 wt.% addition of V can obviously improve the wettability of liquid Sn on porous graphite and the nominal V contents in Sn-V binary alloys has minor effects on the apparent contact angles wetted at 950 °C. Moreover, the V-containing Sn-V alloys were initiated to spread on porous graphite at ~650 °C and reached a quasi-equilibrium state at ~900 °C. Spreading kinetics of Sn-3V alloy on porous graphite well fitted in the classic product reaction controlled (PRC) model. However, our microstructural characterization demonstrated that, besides vanadium carbide formation, the adsorption of V element at the wetting three-phase contact line spontaneously contributed to the reactive spreading and infiltrating of Sn-V alloys on porous graphite. Meanwhile, the formation of continuous vanadium carbides could completely block the infiltration of Sn-V active solder alloy in porous graphite. Affected by the growth kinetics of vanadium carbides, the infiltration depth of Sn-V alloys in porous graphite decreased at increased isothermal wetting temperatures. This work is believed to provide implicative notions on the fabrication of graphite related materials and devices using novel V-containing bonding alloys. Full article
Show Figures

Graphical abstract

Review

Jump to: Research

Open AccessReview
Recent Advances in Barrier Layer of Cu Interconnects
Materials 2020, 13(21), 5049; https://doi.org/10.3390/ma13215049 - 09 Nov 2020
Cited by 2 | Viewed by 604
Abstract
The barrier layer in Cu technology is essential to prevent Cu from diffusing into the dielectric layer at high temperatures; therefore, it must have a high stability and good adhesion to both Cu and the dielectric layer. In the past three decades, tantalum/tantalum [...] Read more.
The barrier layer in Cu technology is essential to prevent Cu from diffusing into the dielectric layer at high temperatures; therefore, it must have a high stability and good adhesion to both Cu and the dielectric layer. In the past three decades, tantalum/tantalum nitride (Ta/TaN) has been widely used as an inter-layer to separate the dielectric layer and the Cu. However, to fulfill the demand for continuous down-scaling of the Cu technology node, traditional materials and technical processes are being challenged. Direct electrochemical deposition of Cu on top of Ta/TaN is not realistic, due to its high resistivity. Therefore, pre-deposition of a Cu seed layer by physical vapor deposition (PVD) or chemical vapor deposition (CVD) is necessary, but the non-uniformity of the Cu seed layer has a devastating effect on the defect-free fill of modern sub-20 or even sub-10 nm Cu technology nodes. New Cu diffusion barrier materials having ultra-thin size, high resistivity and stability are needed for the successful super-fill of trenches at the nanometer scale. In this review, we briefly summarize recent advances in the development of Cu diffusion-proof materials, including metals, metal alloys, self-assembled molecular layers (SAMs), two-dimensional (2D) materials and high-entropy alloys (HEAs). Also, challenges are highlighted and future research directions are suggested. Full article
Show Figures

Figure 1

Back to TopTop