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Advances in Electroless Metal Deposition
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Advances in Electroless Metal Deposition

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: closed (20 May 2022) | Viewed by 10694

Special Issue Editors

Prof. Dr. Eugenijus Norkus

E-Mail Website
Guest Editor
Center for Physical Sciences and Technology, Vilnius, Lithuania
Interests: electroless metal deposition; electrocatalysis; kinetics of autocatalytic metal ion reduction; anodic oxidation of reducing agents
Dr. Loreta Tamasauskaite-Tamasiunaite

E-Mail Website
Guest Editor
Department of Catalysis, Center for Physical Sciences and Technology, Saulėtekio Ave. 3, Vilnius, Lithuania
Interests: nanoparticles; composites; metals; multifunctional materials; catalysts; fuel cells
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Electroless metal plating is a well-known method for deposition of metal coatings as well as for the formation of small (nano-scale) metal particles by a controlled chemical reduction. The autocatalytic metal ion reduction systems are widely used for decorative and functional purposes, i.e., for deposition of conductive metal layers on dielectrics, semiconductors or on conductors with a complicated configuration without an external current. The selection of a suitable reducing agent and conditions of the reaction (temperature, concentration of the reacting substances, etc.) plays a very important role in creating stable solutions and obtaining coatings with the required characteristics, such as purity and surface roughness. On the other hand, the use of conventional hydrogen-containing reducing agents is connected with environmental and technological problems: (i) the plating bath cannot be recycled, i.e., the reducing agent oxidizes irreversibly; and (ii) the plating rate and solution stability are not high enough, which lead to the current search and investigations of the reducing agents of a new type, e.g., charge-transfer reducers, namely, the different oxidation state metal-ion redox couples. Additionally, it is worth noting that investigation of electroless plating systems in non-aqueous solutions is also important for the development of new technological processes.

Therefore, the aim and scope of this Special Issue will be Advances in Electroless Metal Deposition, including conventional as well as newly investigated and developed systems.

Prof. Eugenijus Norkus
Dr. Loreta Tamasauskaite-Tamasiunaite
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • electroless metal deposition
  • electrocatalysis
  • kinetics of autocatalytic metal ion reduction
  • anodic oxidation of reducing agents

Published Papers (5 papers)

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Research

12 pages, 2774 KiB  
Article
Three-Dimensional Au(NiMo)/Ti Catalysts for Efficient Hydrogen Evolution Reaction
by Sukomol Barua, Aldona Balčiūnaitė, Jūrate Vaičiūnienė, Loreta Tamašauskaitė-Tamašiūnaitė and Eugenijus Norkus
Materials 2022, 15(22), 7901; https://doi.org/10.3390/ma15227901 - 09 Nov 2022
Cited by 2 | Viewed by 1033
Abstract
In this study, NiMo catalysts that have different metal loadings in the range of ca. 28–106 µg cm−2 were electrodeposited on the Ti substrate followed by their decoration with a very low amount of Au-crystallites in the range of ca. 1–5 µg [...] Read more.
In this study, NiMo catalysts that have different metal loadings in the range of ca. 28–106 µg cm−2 were electrodeposited on the Ti substrate followed by their decoration with a very low amount of Au-crystallites in the range of ca. 1–5 µg cm−2 using the galvanic displacement method. The catalytic performance for hydrogen evolution reaction (HER) was evaluated on the NiMo/Ti and Au(NiMo)/Ti catalysts in an alkaline medium. It was found that among the investigated NiMo/Ti and Au(NiMo)/Ti catalysts, the Au(NiMo)/Ti-3 catalyst with the Au loading of 5.2 µg cm−2 gives the lowest overpotential of 252 mV for the HER to reach a current density of 10 mA·cm−2. The current densities for HER increase ca. 1.1–2.7 and ca. 1.1–2.2 times on the NiMo/Ti and Au(NiMo)/Ti catalysts, respectively, at −0.424 V, with an increase in temperature from 25 °C to 75 °C. Full article
(This article belongs to the Special Issue Advances in Electroless Metal Deposition)
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11 pages, 3089 KiB  
Article
Electroless Platinum Deposition Using Co3+/Co2+ Redox Couple as a Reducing Agent
by Loreta Tamasauskaite-Tamasiunaite, Yezdi Dordi, Eugenijus Norkus, Ina Stankeviciene, Aldona Jagminiene, Arnas Naujokaitis, Liudas Tumonis, Vytenis Buzas and Laurynas Maciulis
Materials 2021, 14(8), 1893; https://doi.org/10.3390/ma14081893 - 10 Apr 2021
Cited by 4 | Viewed by 1734
Abstract
In the present work, the kinetics of electroless deposition of Pt, using a cobalt ion redox system (Co3+/Co2+) as a reducing agent, has been investigated. The deposition rate of Pt depends on the pH, concentration of reactants, and temperature. [...] Read more.
In the present work, the kinetics of electroless deposition of Pt, using a cobalt ion redox system (Co3+/Co2+) as a reducing agent, has been investigated. The deposition rate of Pt depends on the pH, concentration of reactants, and temperature. The deaeration and bubbling of the plating solution with argon play an essential role. It was found that 0.11 mg cm−2 of Pt films could be deposited on the surface of a roughed glass sheet in one hour without replenishing the solution. Additional data have been obtained on the grounds of electrochemical quartz crystal microbalance experiments. The bubbling (agitation) of the electroless Pt plating solution with argon during the deposition of Pt results in a higher deposition rate and is ca. 3 µg cm−2 min−1. The Pt deposition rate is far less, and is as low as 0.14 µg cm−2 min−1 when the electroless Pt plating solution is not bubbled with argon during the deposition of Pt. Full article
(This article belongs to the Special Issue Advances in Electroless Metal Deposition)
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18 pages, 4554 KiB  
Article
Full Optimization of an Electroless Nickel Solution: Boosting the Performance of Low-Phosphorous Coatings
by Asier Salicio-Paz, Ixone Ugarte, Jordi Sort, Eva Pellicer and Eva García-Lecina
Materials 2021, 14(6), 1501; https://doi.org/10.3390/ma14061501 - 18 Mar 2021
Cited by 11 | Viewed by 2337
Abstract
Univariate and multivariate optimizations of a novel electroless nickel formulation have been carried out by means of the Taguchi method. From the compositional point of view, adjustment of the complexing agent concentration in solution is crucial for fine-tuning free Ni2+ ions concentration [...] Read more.
Univariate and multivariate optimizations of a novel electroless nickel formulation have been carried out by means of the Taguchi method. From the compositional point of view, adjustment of the complexing agent concentration in solution is crucial for fine-tuning free Ni2+ ions concentration and, in turn, the mechanical properties of the resulting coatings. The Ni (II) concentration and the pH are the main parameters which help restrict the incorporation of phosphorous into the Ni layers. On the other hand, the stirring rate, the pH and the reducing agent concentration are the most influential parameters for the corrosion resistance of the coatings. Multivariate optimization of the electrolyte leads to a set of optimized parameters in which the mechanical properties (hardness and worn volume) of the layers are similar to the optimal values achieved in the univariate optimization, but the corrosion rate is decreased by one order of magnitude. Full article
(This article belongs to the Special Issue Advances in Electroless Metal Deposition)
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15 pages, 2277 KiB  
Article
Bimetallic Co-Based (CoM, M = Mo, Fe, Mn) Coatings for High-Efficiency Water Splitting
by Jadranka Milikić, Aldona Balčiūnaitė, Zita Sukackienė, Dušan Mladenović, Diogo M. F. Santos, Loreta Tamašauskaitė-Tamašiūnaitė and Biljana Šljukić
Materials 2021, 14(1), 92; https://doi.org/10.3390/ma14010092 - 28 Dec 2020
Cited by 19 | Viewed by 3228
Abstract
Bimetallic cobalt (Co)-based coatings were prepared by a facile, fast, and low-cost electroless deposition on a copper substrate (CoFe, CoMn, CoMo) and characterized by scanning electron microscopy with energy dispersive X-ray spectroscopy and X-ray diffraction analysis. Prepared coatings were thoroughly examined for hydrogen [...] Read more.
Bimetallic cobalt (Co)-based coatings were prepared by a facile, fast, and low-cost electroless deposition on a copper substrate (CoFe, CoMn, CoMo) and characterized by scanning electron microscopy with energy dispersive X-ray spectroscopy and X-ray diffraction analysis. Prepared coatings were thoroughly examined for hydrogen evolution reaction (HER) and oxygen evolution reaction (OER) in alkaline solution (1 M potassium hydroxide, KOH) and their activity compared to that of Co and Ni coatings. All five coatings showed activity for both reactions, where CoMo and Co showed the highest activity for HER and OER, respectively. Namely, the highest HER current density was recorded at CoMo coating with low overpotential (61 mV) to reach a current density of 10 mA·cm−2. The highest OER current density was recorded at Co coating with a low Tafel slope of 60 mV·dec−1. Furthermore, these coatings proved to be stable under HER and OER polarization conditions. Full article
(This article belongs to the Special Issue Advances in Electroless Metal Deposition)
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14 pages, 2073 KiB  
Article
Enhancing Effect of Chloride Ions on the Autocatalytic Process of Ag(I) Reduction by Co(II) Complexes
by Loreta Tamašauskaitė-Tamašiūnaitė, Aldona Jagminienė, Ina Stankevičienė, Karolis Ratautas, Gediminas Račiukaitis and Eugenijus Norkus
Materials 2020, 13(20), 4556; https://doi.org/10.3390/ma13204556 - 14 Oct 2020
Cited by 5 | Viewed by 1527
Abstract
In this work, the possibilities of increasing the rate of electroless silver plating without a rise in the concentration of reactants or elevation of temperature were studied. The effect of halide additive, namely chloride ions, on the rate of electroless silver deposition was [...] Read more.
In this work, the possibilities of increasing the rate of electroless silver plating without a rise in the concentration of reactants or elevation of temperature were studied. The effect of halide additive, namely chloride ions, on the rate of electroless silver deposition was investigated, using conventional chemical kinetics and electrochemical techniques. It was found that the deposition rate of electroless silver increased 2–3 times in the presence of 10–20 mM of chlorides, preserving sufficient stability of the solution. Full article
(This article belongs to the Special Issue Advances in Electroless Metal Deposition)
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