Special Issue "Advances in Electroless Metal Deposition"

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: 28 February 2021.

Special Issue Editors

Prof. Eugenijus Norkus
Website
Guest Editor
Center for Physical Sciences and Technology, Vilnius, Lithuania
Interests: electroless metal deposition; electrocatalysis; kinetics of autocatalytic metal ion reduction; anodic oxidation of reducing agents
Dr. Loreta Tamasauskaite-Tamasiunaite
Website
Guest Editor
Center for Physical Sciences and Technology, Vilnius, Lithuania
Interests: electroless metal deposition; electrocatalysis; coordination chemistry

Special Issue Information

Dear Colleagues,

Electroless metal plating is a well-known method for deposition of metal coatings as well as for the formation of small (nano-scale) metal particles by a controlled chemical reduction. The autocatalytic metal ion reduction systems are widely used for decorative and functional purposes, i.e., for deposition of conductive metal layers on dielectrics, semiconductors or on conductors with a complicated configuration without an external current. The selection of a suitable reducing agent and conditions of the reaction (temperature, concentration of the reacting substances, etc.) plays a very important role in creating stable solutions and obtaining coatings with the required characteristics, such as purity and surface roughness. On the other hand, the use of conventional hydrogen-containing reducing agents is connected with environmental and technological problems: (i) the plating bath cannot be recycled, i.e., the reducing agent oxidizes irreversibly; and (ii) the plating rate and solution stability are not high enough, which lead to the current search and investigations of the reducing agents of a new type, e.g., charge-transfer reducers, namely, the different oxidation state metal-ion redox couples. Additionally, it is worth noting that investigation of electroless plating systems in non-aqueous solutions is also important for the development of new technological processes.

Therefore, the aim and scope of this Special Issue will be Advances in Electroless Metal Deposition, including conventional as well as newly investigated and developed systems.

Prof. Eugenijus Norkus
Dr. Loreta Tamasauskaite-Tamasiunaite
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • electroless metal deposition
  • electrocatalysis
  • kinetics of autocatalytic metal ion reduction
  • anodic oxidation of reducing agents

Published Papers

This special issue is now open for submission.
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