Special Issue "Advanced Technologies for Materials Characterization"

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Structure Analysis and Characterization".

Deadline for manuscript submissions: 15 November 2020.

Special Issue Editor

Dr. Elijah Borodin
Website
Guest Editor
University of Manchester, Manchester, United Kingdom
Interests: plasticity; material science; materials characterization; mechanics of materials; theoretical physics; high strain rates; severe plastic deformation; numerical simulations

Special Issue Information

Dear Colleagues,

This Special Issue on “Advanced Technologies for Materials Characterization” is intended to highlight and popularize prominent ideas and methods from the different branches of materials characterization. Recent decades have brought new exciting experimental and computational opportunities with unexpected challenges for all researchers in this area. The set of modern experimental technologies, such as 3D EBSD, HRTEM, high-energy synchrotron tomography, high-speed photography and many others, opened new horizons for investigations of materials at different length scales, from atomic to polycrystalline. This has happened along with increases in computational power, which makes it possible to involve several new theoretical approaches, such as molecular dynamics simulations, big data analysis, or machine learning techniques. All these developments and opportunities allow for a qualitatively new level of understanding of the processes occurring inside the materials under the action of special conditions. Among others, it opened possibilities for the modern state of art investigations of complex dynamical systems.

Studies using modern approaches in material characterization, experimental, theoretical, and computational, are very welcome for this issue. Topics of special interest include the following:

  • Characterization of materials at extreme states of any kind, including high-strain-rate and severe plastic deformation conditions;
  • New experimental techniques in materials characterization;
  • Computational methods for characterization of material structure evolution in complex dynamical processes, including new techniques in molecular dynamics simulation;
  • New methods for characterization of complex material microstructures in composites and biomaterials.
Dr. Elijah Borodin
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Materials characterization
  • Microstructure
  • Extreme states of matter
  • 3D EBSD
  • HRTEM
  • Molecular dynamics simulations

Published Papers

This special issue is now open for submission.
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