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Thermal, Mechanical and Dielectric Properties of Polymers and Polymer-Based Composites

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Materials Characterization".

Deadline for manuscript submissions: closed (10 November 2022) | Viewed by 1920

Special Issue Editor


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Guest Editor
School for System Design and Intelligent Manufacturing, Southern University of Science and Technology, Shenzhen 518055, China
Interests: dielectric materials; polymer multiphase systems; advanced composites; nanocomposites

Special Issue Information

Dear Colleagues, 

High-performance, polymer-based dielectric materials are highly desirable in the modern electronics and energy storage industries. In recent years, extensive effort has been devoted to the research and development of polymer-based dielectrics to optimize their thermal, mechanical, and dielectric properties, such as low relative permittivity to reduce the signal propagation delay, low dielectric loss for less signal attenuation, low coefficient of thermal expansion (CTE) to maintain desired dimensional stability and prevent cracking, high thermal conductivity to dissipate heat generated, high temperature stability for operating in harsh environments, desired mechanical flexibility, ductility, toughness, etc. In practice, it is common that a range of distinct or even conflicting properties must be satisfied simultaneously. Such critical challenges have made it necessary for researchers to design new polymeric systems, improve processing and characterization methods, develop new strategies for optimizing and balancing material performance, and further understand embedded mechanisms.

The Special Issue will cover recent research and progress in the field of polymer-based dielectric materials. The topics of interest include, but are not limited to, fundamental research on the relationship between microstructure and thermal, mechanical, and dielectric properties; the development of new dielectric materials for new applications; innovations in processing and characterization technologies; simulation and machine learning methods for the design of new materials; etc. Full papers, communications, and reviews are welcome.

Prof. Dr. Ke Wang
Guest Editor

Manuscript Submission Information

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Keywords

  • polymers
  • composites
  • dielectric properties
  • mechanical properties
  • thermal properties
  • electronics
  • energy storage
  • modelling

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Published Papers (1 paper)

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Research

24 pages, 8264 KiB  
Article
Control of Dielectric and Mechanical Properties of Styrenic Block Copolymer by Graphite Incorporation
by Florin Ciuprina, Denis Mihaela Panaitescu, Laura Enache, Celina Maria Damian, Ramona Marina Grigorescu, Augusta Raluca Gabor, Cristian Andi Nicolae, Cristina Lavinia Nistor and Roxana Trusca
Materials 2022, 15(21), 7577; https://doi.org/10.3390/ma15217577 - 28 Oct 2022
Cited by 5 | Viewed by 1546
Abstract
The structure–property relationship of dielectric elastomers, as well as the methods of improving the control of this relationship, has been widely studied over the last few years, including in some of our previous works. In this paper, we study the control, improvement, and [...] Read more.
The structure–property relationship of dielectric elastomers, as well as the methods of improving the control of this relationship, has been widely studied over the last few years, including in some of our previous works. In this paper, we study the control, improvement, and correlation, for a significant range of temperatures, of the mechanical and dielectric properties of polystyrene-b-(ethylene-co-butylene)-b-styrene (SEBS) and maleic-anhydride-grafted SEBS (SEBS-MA) by using graphite (G) as filler in various concentrations. The aim is to analyze the suitability of these composites for converting electrical energy into mechanical energy or vice versa. The dielectric spectroscopy analysis performed in the frequency range of 10 to 1 MHz and at temperatures between 27 and 77 °C emphasized an exponential increase in real permittivity with G concentration, a low level of dielectric losses (≈10−3), as well as the stability of dielectric losses with temperature for high G content. These results correlate well with the increase in mechanical stiffness with an increase in G content for both SEBS/G and SEBS-MA/G composites. The activation energies for the dielectric relaxation processes detected in SEBS/G and SEBS-MA/G composites were also determined and discussed in connection with the mechanical, thermal, and structural properties resulting from thermogravimetric analysis, differential scanning calorimetry, Fourier-transform infrared spectroscopy and X-ray photoelectron spectroscopy analyses. Full article
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