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Flexible Electronic Materials and Devices: Preparation and Application

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".

Deadline for manuscript submissions: 20 October 2024 | Viewed by 66

Special Issue Editor

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Guest Editor
Department of Physics, Hong Kong Baptist University, Kowloon Tong, Hong Kong, China
Interests: organic semiconductors

Special Issue Information

Dear Colleagues,

Flexible electronics have advanced significantly in the past decade, enabling their application in numerous domains where conventional rigid electronics cannot be applied, such as bioelectronics and electronic sensors, etc. Two main strategies have been proposed to introduce flexibility in electronic materials: reducing the thickness of commercially available inorganic semiconductor materials and designing novel semiconductor materials with intrinsic mechanical flexibility. A wide range of materials (inorganic semiconductors, organic semiconductors, oxide semiconductors and 2D materials) have been used to realize flexible electronic devices for various applications. Further advances in flexible electronic devices would require the matrimony of material synthesis, device physics and engineering, and advanced characterization expertise to enable the development of high-performance devices with decent reliability for practical real-world applications.

This Special Issue aims to compile research papers, short communications, and review articles focused on the synthesis of novel materials, device design, fabrication, and the advanced characterization of various flexible electronic devices for the identication of the main milestones in the roadmap of future flexible electronics research.

Dr. Shu-Jen Wang
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • biosensors and bioelectronics
  • thin-film transistors
  • flexible chemical sensors
  • flexible electronic materials
  • flexible healthcare sensors
  • advanced characterization
  • novel device architectures
  • new flexible materials synthesis
  • reliability of flexible devices

Published Papers

This special issue is now open for submission.
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