Advanced Composite Materials for Next-Generation Electronic Devices
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".
Deadline for manuscript submissions: 20 November 2025 | Viewed by 111
Special Issue Editors
Interests: electronic materials
Interests: electronic materials
Interests: MEMS technology; electronic packaging and microassembly technology; smart materials
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Advanced composite materials have made remarkable progress over the past decade, demonstrating immense potential in fields where traditional materials fall short, such as flexible electronics, energy storage, sensing, and high-performance computing. To meet the diverse requirements of modern applications, a wide range of advanced composite materials have been developed. Further advancements in next-generation electronic devices demand the deep integration of material design, numerical simulation, reliability analysis, and advanced manufacturing processes to develop high-performance, highly reliable devices.
This Special Issue aims to compile high-quality research papers, short communications, and review articles focusing on the following topics:
Modeling, Simulation, and Design of ME Composites and Devices: multi-physics coupling models, nonlinear behavior simulation, and performance prediction.
Reliability Analysis of Electronic Packaging Systems: failure mechanisms, lifespan evaluation, and reliability enhancement strategies.
Optimization Design of Advanced Composite Materials and Devices: utilizing machine learning, topology optimization, and multi-objective optimization for performance enhancement.
Advanced Manufacturing Processes: precision processing and integration technologies for advanced composite materials and electronic devices.
Characterization and Applications: performance characterization and applications of advanced composite materials.
Through this Special Issue, we hope to identify key milestones in the future research of advanced composite materials for next-generation electronic devices, driving innovation and development in this field.
Dr. Yang Shi
Prof. Dr. Junjie Ye
Dr. Yongkun Wang
Guest Editors
Manuscript Submission Information
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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- ME materials
- electronic packaging devices
- numerical simulation
- topology optimization
- reliability analysis
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